Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
The images and data contained herein is owned by Macquarie and is intended for use only by potential purchasers of goods shown herein. Except for such permitted usage, no other use of the images and data is permitted and such images and data shall not be exhibited or shown in any websites or social media or for any commercial purposes without Macquarie’s written permission. Therefore, no seller of goods like the goods shown herein has any right or authority to show or exhibit any images or data shown herein.
Date of Manufacture: 2015
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
Other Missing or damaged parts: Not reported. Please inspect to confirm.
High-Performance Packaged IC Component Inspection
3D Ball Inspection : Between Balls Inspection, PoP Interconnect 3D Inspection, and Land Side Cap (LSC) Inspection
3D LGA Inspection : pad coplanarity, offset, pitch and width
QFN 2D Inspection : . The system looks for contact pad defects (dirt, burr, size, shape, position), sawing defects (broken corners, vertical burr, irregular edges, component size) and package defects (dirt, voids, scratches).
Top and Bottom Package Visual Inspection / xPVI and xPVI Plus, xCrack+ Inspection, Mark Inspection, Top 2D PoP Pad Inspection, Passive Component Inspection : voids, scratches, pits, package incomplete fill, non-homogeneous molding, foreign material, chips and similar defects.
3D Lead Inspection : lead coplanarity, offset, skew, pitch, length, width, span, sweep, slant, terminal dimension, body standoff and foot angle.
Automatic Tray Pitch Change-Over
Pocket Integrity Check
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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