Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Date of Manufacture: May 2013
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 10/15/2022
Missing parts: No missing parts.
Defective parts: Chamber 2 is defective. For more details, please see configuration.
OEM | TEL | ||
Tool Model | CELLESTA Plus | ||
Process | Cylinder etch cleaning | ||
Software Version (include revision #) | 3.04.238Nb |
System Power Rating | ・3Φ 200V for CONTLOR EP1 ・3Φ 200V for HEATER EP2 ・1Φ 200V for EXHAUST SENSOR EP3 | ||
Loading Configuration | 4 LP |
Vendor Chm Model | Chemicals / Gases Used (not to use Micron Proprietary names) | ||||
Chm/Unit Position 1 | LSB(1) | DHF | |||
Chm/Unit Position 2 | LSB(2) | SC1 | |||
Chm/Unit Position 3 | LSU(1) Main body | 49% HF | |||
Chm/Unit Position 4 | LSU(3) Main body | 49% HF |
For more details, please see configuration. |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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