Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (VA)

Applied Materials (AMAT) Endura II Aluminum Interconnect

Asset ID: 69484

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Applied Materials (AMAT)

Endura II Aluminum Interconnect

PVD (Physical Vapor Deposition)

Deposition Equipment

Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Manassas, United States

Available date: Currently Available

Process 100s 73 Reflow

Software Version CPCI B50140

System Power Rating 208 AC 3-Phase +480V

Loading Configuration 3load port

 Description Chemicals / Gases Used

Chm Position  4 Hot AL N2,Ar

Chm Position  5 SIP N2,Ar

Chm Position  C RPC He,N2,Ar,H2

Chm Position _D DSTTN N2,Ar

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