Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
Centura AP DPS AdvantEdge G2 Poly
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: 8/26/2022
Process: POLYETCH
Process Chb 1,2,3,&4: DPS-II w/ TGN
From original tool PO, please inspect to verify
Standard Specifications
Software Revision: E2.3_43
GEM SEC Revision: GB7.10_21
Wafer Size: Diameter 300+/- 0.05mm(SEMI M28), 775 +/- 25um, Notch
Carrier: FOUP (Comply with SEMI E47.1 (25wafers))
Water Leak Detector: Configured
Regulated N2 Gas Supply Line: Configured
Corrossion Resistant FI & SWLL: Configured
Heated SWLL w/Ceramic diffusrs: Configured
Transfer chbr: Accelerator
Loadlock Isolation- Slit Valve: AP Chemraz 513 Elastomer
Atmospheric Robot: Kawasaki Single Fixed Robot with Edgegrip
Wafer Pass Through: Not available
Loadports: 3 loadports
Loadport type: Enhanced 25 wafer FOUP
Open Cassettes Supported: Not Applicable
Light Tower: 3 light tower
EMO Type: Turn to Release
System Monitors: Monitor #1 is Flat Panel with Keyboard on stand / Monitor 2 is through the wall flat panel (optional)
Monitor Cable lengths: 25ft with 16ft effective
IPUP Type: Alcatel A100L or Toyota 0395-11103
Supporting Remote Units
Etch Common AC Rack (DPS II): Cutler Hammer Blue AC Rack- top level part number contains 19 different kits for AC rack
Chillers (DPS II): x2-H2000 & x4 ATS NX20A
Coolant: DIEG/Galden
Chiller Hose Length: 75 feet
Hardware Configuration
Process Chb 1,2,3,&4: DPS-II w/ TGN
Chamber hardwareAssy: MS411037-XA-BMA1A(consists of 24 individual kit assemblies)
Endpoint type (Eye D IEP): Endpoint type (Eye D IEP)
Plasma State Monitor: (1 per system)
ESC type: ESC, ASSY, 300MM DPS2
Single Ring- Ceramic single ring: w//.12 pocket
TMP (Shimadzu) 3400l: TMP 3000 l/s, BOC Edwards
Upper Chamber Liner: Upper Chamber Liner
Lower Chamber Liner: Lower Chamber Liner
Inner SV Door: Inner SV Door
Tunable Gas Nozzle: w/ceramic weldment
RF Generator: (3 KW / 13.56 Mhz) (DPS2 #1 Bottom)
RF Generator: (1.5KW / 13.56 Mhz) (DS2 #2 Bottom)
Bias Match (DPS2): Bias Match (DPS2)
Source Match (DPS2): Source Match (DPS2)
Oring kit for Process Exp: Kalrez #8085
ESR80WN: EABARA
FRC located in Gas Panel: NSR# 618541-1
Gas Box Configuration
Gas line 1: Gas line 1-Cl2 400 sccm- GF125
Gas line 2: Gas line 2-Cl2 50 sccm- GF125
Gas line 3: Gas line 3-HBr 600 sccm- AE-PN780CBA
Gas line 4: Gas line 4-HE 200 sccm- GF125
Gas line 5: Gas line 5-N2 200 sccm- GF125
Gas line 6: Gas line 6-O2 500 sccm- GF125
Gas line 7: Gas line 7-O2 50 sccm- GF125
Gas line 8: Gas line 8-SF6 250 sccm- GF125
Gas line 9: Gas line 9- BCL3 400 sccm- GF125
Gas line 10: Gas line 10-CF4 250 sccm- GF125
Gas line 11: Gas line 11 NF3 100 sccm- GF125
Gas line 12: Gas line 12-Ar 400 sccm- GF125
Gas Panel: Standart
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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