Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
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Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
Audit to verify
==================== OEM Feature for reference ======================
The Feature of Test system Cellcia
Cellcia™ series is the next generation wafer probing system for 300mm wafers. Wafers are tested in a multi test cell system simultaneously. The testing process involves distributing wafers into the array of test cells to accomplish fast turn-around-time compared to existing prober systems. The multi-layer system structure significantly reduces the test footprint and achieves greater wafer output per square meter than conventional probers. The Cellcia™ series is an innovative test platform, which make total test cost lower.
Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost.
Wafer size (mm) : 300
Application : Memory, Wafer level burn-in
Stage technology : Vacuum contact
XY probing accuracy (μm) : ±5.0
Z probing accuracy (μm) : ±5.0
Probing force (kg) : 200
Optical system : ASU/BCU-Ⅱ
Operation system : Windows + PLC
Number of cell : 12 or 25
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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