Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
Date of Manufacture: 2018
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
DSL7160-0004- on production
DSL7160-0005- on production
DSL7160-0007- de-installed & store at warehouse area (unpacked)
Wavelength of Laser: 355 nm (Type A & Type A2)
Laser Make/ Model: DISCO/ Type A
Lifespan of laser: used more than 3 years
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
| Specification | Unit | ||
|---|---|---|---|
| Processing method | - | Ablation | |
| Max. workpiece size | mm | Φ300 | |
| X-axis (Chuck table) | Processing range | mm | 310 |
| Moving speed | mm/s | 0.1 ～ 600 | |
| Y-axis (Chuck table) | Processing range | mm | 310 |
| Index step | mm | 0.0001 | |
| Positioning accuracy | mm | 0.003/310 (Single error) 0.002/5 | |
| Z-axis | Moving resolution | mm | 0.00005 |
| Repeatability accuracy | mm | 0.002 | |
| θ-axis (Chuck table) | Max. rotating angle | deg | 380 |
| Machine dimensions (W×D×H) | mm | 1,200 × 1,550 × 1,800 | |
| Machine weight | kg | Approx. 1,750 | |
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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