Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Location of Equipment: San Jose, United States
Available date: Currently Available
1. Automatic Wafer handling robot system with 200mm and 300mm wafer handling capability and wafer pre-aligner.
2 . Two 300mm FOUP load ports with FOUP ID readers and control software.
3. X-ray generator and Cu COLORS beam module for XRR and XRF measurements.
4. X-ray generator and Mo COLORS beam module for XRF measurements.
5. Sample stage with vacuum chuck for 200mm and 300mm wafers.
Stage motion is computer controlled for axes X, Y, 0 and Z.
6. Highly accurate and precise goniometer with direct sensing optical encorder system
7. Control/and data processing system ccmsisting of:
- Control computer -with Windows XP, LCD monitor
- Measurement software for XRR and XRF
- Data processing software for XRR and XRF
8. Air cooling Chiller
9. Center chip for stage calibrartion
10. Isolated Stone Base for optic mechanism.
11. Cognex Pattern recognition
12. Anti-vabration structure
13. GEM 300 communication software (Rigaku standard specification)