Macquarie Equipment Trading on behalf of Micron Memory Japan, G.K. (F15)

FEI Company Helios NanoLab 460F1

Asset ID: 208475

Print spec sheet

FEI Company

Helios NanoLab 460F1

Focused Ion Beam (FIB)

Metrology Equipment

Equipment details:

Date of Manufacture:

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 2/10/2021

YE - FEI Helios 460F1


Tool will stop the operations on March 15 and de-installation can start on the same day.

The tool removal is scheduled for March 26, 2021.


Technical Specications

• electron landing voltage 20 V ... 30 kV

• ion landing voltage 500 V . . . 30 kV

• electron beam current ≤ 0.1 µA

• ion beam current ≤ 65 nA

• electron source Schottky thermal eld emitter

• resolution optimal WD (SEM) @ 2 . . . 15 kV < 0.6 nm

• resolution optimal WD (SEM) @ 1 kV < 0.7 nm

• resolution optimal WD (SEM) @ 200 V with beam deceleration < 1.5 nm

• resolution (STEM) < 0.6 nm

• ion source Gallium liquid metal

• resolution (FIB) 30 kV < 4 nm

• resolution (EDX) < 30 nm


Specimen Stages

• Flipstage 3 with in situ STEM 3 detector

• 5 axis all piezo motorised

• 100 mm XY motion

• IGT-Loadlock

• Quick Loader



CONFIGURATION DETAILS:

· Electron source

- Schottky thermal field emitter, over 1 year lifetime


· Ion source

- Gallium liquid metal, 1000 hours


· Landing voltage

- 20 V – 30 kV SEM

- 500 V – 30 kV FIB


· SEM resolution

- Optimal WD

0.6 nm @ 2–15 kV

0.7 nm @ 1 kV

1.5 nm @ 200 V with beam decleration

- Coincident WD

0.8 nm @ 15 kV

1.2 nm @ 1 kV


·FIB resolution coincident WD

- 4.0 nm @ 30 kV using preferred statistical method

- 2.5 nm @ 30 kV using selective edge method


· In situ TEM sample liftout

- EasyLift EX Nanomanipulator


· Stage

- 5 axis all piezo motorized

- 100 mm XY motion

- QuickFlip shuttle

- Automated loadlock


· Sample types

- Wafer pieces, packaged parts,


TEM

- Grids, whole wafers up to 100 mm

· Max. sample size

- 100 mm diameter with full travel


· User interface

- Windows® 7 GUI with integrated SEM, FIB, GIS, simultaneous patterning and imaging mode

- Two 24-inch widescreen LCD

monitors


 Beam chemistry

- MultiChem Gas Delivery System(Pt, W, Carbon, TEOS)


All items on desks in the photo are included in tool.

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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