Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

Disco Hi-Tec DFD6361

Asset ID: 210926

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Disco Hi-Tec

DFD6361

Wafer Dicing Saw

Sawing

Equipment details:

Date of Manufacture: 2019

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available


Tool config is based on original PO, please verify tool details at tool inspection


Technical Data :

300mm Chuck

Spindle Max revolution : 60,000 min-1


Air : 0.5MPa :378 L/min(ANR)

Clean Air : 0.5MPa : 265 L/min(ANR)

N2 : 0.5MPa : 35 L/min(ANR)

Cutting Water : 0.2MPa : 14 L/min

Cooling Water : 0.2MPa : 3 L/min


Voltage : 200 - 240 VAC+/-10%, 3 phase, , 50/60Hz

Full Amp : 18A

Machine Main Breaker rating : 20A

Max load : 8A

Interrupt current : 10,000 A.I.C.

Mass : 2150 kg


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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