Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
Date of Manufacture: 2019
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
DFD6361 offers highly consistent and dependable cut quality through the new Synchro Spindle™ featuring superior radial rigidity. An atomizing nozzle cleaning mechanism can also be installed in the spinner unit as an option to effectively clean wafers after dicing (Patent no.3410385)
|Specification||Unit||1.2, 1.8 kW||2.2 kW|
|Max. workpiece size||mm||Φ300|
|Cutting speed||mm/s||0.1 ～ 600|
|Positioning accuracy||mm||Within 0.002/310|
(Single error) Within 0.002/5
|Z-axis||Max. stroke||mm||14.7 (For Φ2 inch blade)||14.9（For Φ3 inch blade）|
|θ-axis||Max. rotating angle||deg||380|
|Spindle||Rated torque||N・m||0.19（1.2 kW）|
|Revolution speed range||min‐1||6,000 ～ 60,000||3,000 ～ 30,000|
|Machine dimensions(W×D×H)||mm||1,200 × 1,550 × 1,800|
|Machine weight||kg||Approx. 2,050|
*Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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