Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

Disco Hi-Tec DFL7160

Asset ID: 210854

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Disco Hi-Tec


Laser Saw


Equipment details:

Date of Manufacture: 2018

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available

DSL7160-0004- on production

DSL7160-0005- on production

DSL7160-0007- de-installed & store at warehouse area (unpacked)

Wavelength of Laser: 355 nm (Type A & Type A2)

Laser Make/ Model: DISCO/ Type A 

Lifespan of laser: used more than 3 years

DFL7160 3 Q'ty

Fully Automatic Laser Saw

  • DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing.
  • This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.
  • Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism.

*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface


Processing method-Ablation
Max. workpiece sizemmΦ300
(Chuck table)
Processing rangemm310
Moving speedmm/s0.1 ~ 600
(Chuck table)
Processing rangemm310
Index stepmm0.0001
Positioning accuracymm0.003/310
(Single error) 0.002/5
Z-axisMoving resolutionmm0.00005
Repeatability accuracymm0.002
(Chuck table)
Max. rotating angledeg380
Machine dimensions (W×D×H)mm1,200 × 1,550 × 1,800
Machine weightkgApprox. 1,750

*Product appearance, features, specifications, and other details may change due to technical modifications.

*Please read the standard specification sheet thoroughly before use.

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