Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

Applied Materials (AMAT) VeritySEM 4i

Asset ID: 210937

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Applied Materials (AMAT)

VeritySEM 4i

SEM - Critical Dimension (CD) Measurement

Metrology Equipment

Equipment details:

Date of Manufacture: 2010

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available


Tool config is based on original PO, please verify tool details at tool inspection


Standard Equipment

Thermally assisted field emission electron gun

Patented electron optics (including In-Lens & Top detector)

SEM auto focus and auto stigmation module

3x300mm open cassette ports

Standing / Sitting operator console

3D sidewall imaging

Signal Tower

Central Recipe database server (Tower type, for First in Fab)


Application Specification METROLOGY

Repeatability: Lines & CH L-0.2nm CH-0.25nm; Slope Angle STI/DD/Litho 1deg/1deg/1deg; Height STI/DD/Litho 10nm/10nm/17nm

Reproducibility: Lines & CH L-0.2nm CH-0.25nm; Slope Angle STI/DD/Litho 1deg/1deg/1deg; Height STI/DD/Litho 10nm/10nm/17nm


VeritySEM4i: Lines & CH 0.9nm


IMAGING

Image resolution: 1.65nm @ 800,0 V

Side wall imaging: 15 degrees tilt at 4 directions

HAR imaging: 1:30 features

ABW: 10.5nm

Accelerating Voltage: 0.2kV to 2.5kV, Extraction V. up to 4KV

Probe Current: 5pA - 500pA


System Performance

Throughput

5 sites/wafer: Lines/Spaces >80 WPH; Slope/Height 13 WPH

20 sites/wafer: Lines/Spaces >52 WPH

PR Success rate: 99.70%

MTBF: 1000 hours

MTTR: 4 hours

MTBA: 24 hours

Availability: 95%


Footprint Configuration

4x200 & 4x150 OC: w/o Service Area 4.24 sqm; w/ Service Area 7.14 sqm

3x200 SMIF: w/o Service Area 4.61 sqm; w/ Service Area 7.40 sqm

2x300 FOUP: w/o Service Area 5.15 sqm; w/ Service Area 7.48 sqm

3x300 FOUP: w/o Service Area 6.21 sqm; w/ Service Area 8.34 sqm


Wafer Particle Contamination

Front 0.09um particles: 25 PWP/wafer (with mini environment)

Front 0.2um particles: 5 PWP/wafer (with mini environment)

Back 0.2um particles: 3000 PWP/wafer (with mini environment)


Carbonization: 0.05nm per visit 


Equipment Parameters

Wafer size: 150mm, 200mm, 300mm

Optical magnification 16x, 220x (FOV: 450mm - 6000mm)

SEM magnifications: 1000x to 400,000x (100mm - 0.25mm)

Stage: 300mm/s with continuous motion trackball


Damage/Missing parts list

Damage:LASER INTERFEROMTR SYSTMRLE-20

Damage:X, Encoder/Scale Assy Wired

Damage:Y, Encoder/Scale Assy Wired

Damage:MICRO-REGULATOR MR BIT 1/4 08

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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