Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Centura AP DPS AdvantEdge G2 Poly - Chamber Only
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 5/12/2023
DRY ETCH 15-3AMAT_CENG2_PLY_03 AMAT CENG2 POLY
ONE CHAMBER C ONLY. IT IS JUST PLASTIC-WRAPPED
UP.
no missing or damaged parts.
CONFIGURATION FOR CHAMBER C:
[Chamber C]
Chamber type:AdvantEdge G2
Gas config.(sccm)=MFC full scale
HBR(400）/CL2(50)/CL2(400)/O2(10)/O2(100)/
HE(400)/N2(200)/SF6(200)/CF4(200)/Ar(400)
Source 13.56MHz, max 3000 W
Bias 13.56MHz Hz, max 1500 W
Lid Temp Control ~95℃
ESC Temp Control ~85℃
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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