KLA-Tencor Corp. Surfscan SP2

Equipment details:

Date of Manufacture: December 2006

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Process: BEVELINSP

Vacuum wafer handling.

Tool config is based on original PO, please verify tool details at tool inspection

SW: NGS5.4 SR03 (Microsoft Windows XP)

Wafer Size: 300mm SEMI Notch

Carrier

3 AdvanTag SW CID, Phx, TDK (load port)

6 user-configurable LEDs to display the loadport status

Load/unload button for manual delivery hand-off

Cassette / wafer mapping which allows the tool to generate a wafer map of the 300mm FOUP and detect wafer presence, empty slots and cross-slotted wafer. The wafer map can be displayed on the user screen and sent to a SECS host.

Facilities

Power: 208 VAC, 1Ø208V-N

CDA: > 85-105 psi (0.586 - 0.724 MPa) of CDA at 1 SCFM (28.317 L/min)

Vac: > 21-30 in. Hg (71-102 kPa) constant vacuum at 1 SCFM (28.3 L/min). 

Chamber

Powder Coat Panels Kit

200/300mm Vacuum option

Load port: Vacuum 300mm Triple FIMS

Application

2mm Edge Exclusion

Oblique Incidence Illumination (High / Standard / Low)

Normal Incidence Illumination (High / Standard / Low)

Enhanced XY Coordinates

IDM SP2

Grading and Sorting

Spatial Filter (20 degree)

Spatial Filter (40 degree)

Spatial filter (Back)

High Sensitivity Inspect Mode

High Throughput Inspect Mode

Options

Haze

Haze Analysis

Wafer size: 300mm XY Calibration Wafer with first Article

HARDWARE CONFIGURATION

Others: 5 Color Light Tower (RBYGW)

Ethernet

E84 enabled for OHT & AGV/RGV

E87 (Based on E39)

GEM/SECS and HSMS

E40/ E94/ E90 / E116

Main Computer

Intel®Xeon™ CPU

3.5 GB RAM Memory

DVD- ROM

Mouse

Keyboard

3.5" Floppy

FEC computer

Intel®Pentium®4 CPU

504 MB RAM Memory

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales