Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)
2300 Exelan Flex EX+ - Chamber Only
Etch/Ash/Clean - Plasma Processing
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
DRY ETCH 15-3LAM_EXELEXP_60_3 LAM FLEXEXP
Sale of package for Qty 3 pcs of 2300 Exelan Flex EX+ - Chambers Only
Other Missing or damaged parts: Not reported.
[Process Module 1]
Chamber type:Flex EX Plus
Gas config.(sccm)=MFC full scale
C4F8(50)/CF4(200)/O2(3000)/Ar(1000)/
CO(500)/CH3F(100)/O2(30)/CHF3(100)/
O2(300)/Xe(500)/C4F6(50)/CH2F2(100)/O2(10)
Source 60MHz 2500W/27MHz 3000W/2MHz 8500W
Lid Temp Control ~140℃
ESC Temp Control ~60℃
[Process Module 1]
Chamber type:Flex EX Plus
Gas config.(sccm)=MFC full scale
C4F8(50)/CF4(200)/O2(3000)/Ar(1000)/
CO(500)/CH3F(100)/O2(30)/CHF3(100)/
O2(300)/Xe(500)/C4F6(50)/CH2F2(100)/O2(10)
Source 60MHz 2500W/27MHz 3000W/2MHz 8500W
Lid Temp Control ~140℃
ESC Temp Control ~60℃
[Process Module 1]
Chamber type:Flex EX Plus
Gas config.(sccm)=MFC full scale
C4F8(50)/CF4(200)/O2(3000)/Ar(1000)/
CO(500)/CH3F(100)/O2(30)/CHF3(100)/
O2(300)/Xe(500)/C4F6(50)/CH2F2(100)/O2(10)
Source 60MHz 2500W/27MHz 3000W/2MHz 8500W
Lid Temp Control ~140℃
ESC Temp Control ~60℃
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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