Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.

Micro Automation, Inc. M-1006

Asset ID: 208805

Print spec sheet

Micro Automation, Inc.

M-1006

Saws

Metal Fabricating

Equipment details:

Date of Manufacture:

Currently Configured for: To be determined

Current Equipment Status: Available

Location of Equipment: Milpitas, United States

Available date: Currently Available

Micro Automation, Inc. Saw, Model M-1006


System specifications:

• Wafer Size: To 6 inches, To 155mm

• Index Stepping Range: .00025" to wafer diameter, 6 microns to diameter

• Minimum Index Step: .000125 inch, 3 microns

• Cutting Feed Speed: 0.05 to 12 inches/seconds, 1.25 to 300 mm/seconds

• Return Stroke: to 12 inches/seconds, 300 mm/seconds

• Spindle Index Repeatability: .00016 inch, 4 microns

• Chuck Flatness: .0004 inch across six inches, 10 microns over 155 mm

• Cutting Depth Range: Blade limited

• Cutting Depth Increments: .00025 inch, 6 microns

• Chuck Rotation: 0 to 120 degrees

• Rotation Resolution: .0025 degrees

• Microscope Magnification: 60X Monocular or Split Field TV

• Spindle Speed:5,000 to 45,000 rpm

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