Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.
Date of Manufacture:
Currently Configured for: To be determined
Current Equipment Status: Available
Location of Equipment: Milpitas, United States
Available date: Currently Available
Orthodyne Electronics Wire Bonder, Model M20B, with Nikon SMZ660 Microscope
Ultrasonic large wire bonder
Wire / Ribbon size: Wire 4 to 20 mil aluminium / Gold, 3 - 10 mil copper
Cutoff method: Cut / Pull
Work holder: 60 mm / 100 mm
Modes of operation: Semiautomatic and manual
Operator control: Top button / Foot switch
Working range: 1"
Type: True panto graph
Machine stops: Home, first search, loop, second search
Ultrasonic generator Type: ORTHODYNE 300 Series 2 Channels
Frequency: 60 kHz, Phase-locked
Power output: 0 - 25 Watts
System check: Test push button
Time range: 0 - 500 ms, 30 ms Prebond delay
Transducer: ORTHODYNE Piezoelectric ceramic
Bonding head: Bonding direction: Front to back
Tool type: Large wire (4 to 20 mil): Larrison twin-groove
Deep access ribbon (1.0 x 5 to 2 x 40 mil): Flat face with guide slot
Deep access wire (3 to 5 mil): Single groove with guide hole
Wire and ribbon handling
Bonding force: 95 to 1100 grams
Cutoff preload: 0 to 500 grams
Step back range: 0 to 0.300"
Loop and search height: Adjustable
Bonding plane height differential: 0.100", With manual Z option
Power: 115/230 V, 3/1.54, 50 to 60 Hz, Single phase (100 V option).
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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