Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.

ASM Pacific Technology Ltd. AB530

Asset ID: 208818

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ASM Pacific Technology Ltd.

AB530

Wire Bonder

Bonder

Equipment details:

Date of Manufacture:

Currently Configured for: To be determined

Current Equipment Status: Available

Location of Equipment: Milpitas, United States

Available date: Currently Available

ASM AB530 Automatic Wire Bonder, Model AB530, with Olympus SMZ-140 microscope


ASM AB530 Automatic Ultrasonic Wedge Bonder

Applications : Chip-on-board, multi-die / multi-PCB, high lead count, etc

High speed bonding

Fine pitch capability for advanced packages

Cost saving by widely implementing linear and DDR motor systems

Multi-unit / multi-PCB bonding capabilities

Includes Tool Box with Spare Parts


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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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