Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
Date of Manufacture: 2015
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
Other Missing or damaged parts: Not reported. Please inspect to confirm.
High-Performance Packaged IC Component Inspection
3D Ball Inspection : Between Balls Inspection, PoP Interconnect 3D Inspection, and Land Side Cap (LSC) Inspection
3D LGA Inspection : pad coplanarity, offset, pitch and width
QFN 2D Inspection : . The system looks for contact pad defects (dirt, burr, size, shape, position), sawing defects (broken corners, vertical burr, irregular edges, component size) and package defects (dirt, voids, scratches).
Top and Bottom Package Visual Inspection / xPVI and xPVI Plus, xCrack+ Inspection, Mark Inspection, Top 2D PoP Pad Inspection, Passive Component Inspection : voids, scratches, pits, package incomplete fill, non-homogeneous molding, foreign material, chips and similar defects.
3D Lead Inspection : lead coplanarity, offset, skew, pitch, length, width, span, sweep, slant, terminal dimension, body standoff and foot angle.
Automatic Tray Pitch Change-Over
Pocket Integrity Check
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