Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
Date of Manufacture: 2010
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
Damage/Missing parts list
Please inspect tool to reconfirm
| Local accuracy | ± 3µm @ 3 sigma |
|---|---|
| Global accuracy | ± 5µm @ 3 sigma |
| Vision system | 4Mpix, 6 x 6mm FOV for substrate / upwards camera 12 x 12mm for wafer camera |
| Strips, Boats, Panels | 340mm |
| C2W | 12" |
| Fluxer | option, various cavity plates available |
| Multi Chip | included |
| UPH (dipping process) | 6,000 |
| UPH (FO-WLP / no dipping) | up to 9,000 |
| Clean room class | ISO 5 (optionally) |
| Capability integrity | enhanced standard |
| Local reflow | not available |
| Lead time | 8 - 10 weeks |
| Bond force | 0.5 - 50N |
| Die size | 0.3 - 30mm |
| Die thickness | 50µm - 3mm, thinner on request |
| Footprint | 1,600 x 1,200 x 1,880mm (W x D x H) (with dual monitor) |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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