Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
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Date of Manufacture:
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
Qty-3- Not overhaul
OH Vendor | Module | S/N |
EDWARDS | TPU WESP | 146083413 |
EDWARDS | TPU WESP | 146108803 |
EDWARDS | TPU WESP | 146092259 |
The Atlas TPU is a world proven system and the semiconductor industry's standard abatement system for CVD. In one model, there is suitability for all CVD and Etch applications, enabling World Semiconductor Council PFC emission reduction targets to be met. Each inlet can be individually configured for the highest level of abatement of all PFC gases, Fluorine (F2) or Chlorine TriFluoride (ClF3)
Process connections | |
Process gas inlets | NW40 stainless steel |
Bypass outlet | NW40 stainless steel |
Abatement system exhaust outlet | 75 mm diameter polypropylene |
Cabinet extraction outlet | 150 mm diameter x 150 mm deep, painted mild steel |
Services connections | |
Nitrogen inlet | 1/2 inch Swagelok, stainless steel |
Oxygen inlet | 1/4 inch Swagelok, stainless steel |
Compressed dry air inlet | 1/4 inch Swagelok, stainless steel |
Fuel gas inlet | 3/4 inch Swagelok, stainless steel |
Cooling-water supply inlet | 25 mm GF union, polypropylene |
Cooling-water return outlet | 25 mm GF union, polypropylene |
Make-up water inlet | 25 mm GF union, polypropylene |
Acid water drain outlet | 25 mm GF union, polypropylene |
Electrical connections | |
Electrical supply cable leadthrough | 32 mm cable-gland, suitable for 5-core double insulated cable |
Customer interface cable leadthroughs | 16 mm cable-glands |
Customer interface connections | Screw terminals |
Power Requirements | |
Supply | 3-phase 400,220,208,200V, 50/60Hz 1-phase 100V, 50/60Hz |
Nominal power requirements | 1.3kW |
Mechanical Data | |
Mass | 530kg |
101.5kg (WRU E Model) | |
103.5kg (WRU S J Models) |
Edwards offers the WESP (Wet Electro-static Precipitator) for the efficient removal of particles downstream of a process chamber abatement device. The system transfers the particles into a water stream without generating significant backpressure, and can be used in conjunction with most abatement devices. Efficient removal of particles from semiconductor process exhausts minimizes the risk of blockages in exhaust ducts. WESP is well-suited for 300 mm CVD, FPD, Solar Cell and MOCVD processes.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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