Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.
Date of Manufacture:
Currently Configured for: To be determined
Current Equipment Status: Available
Location of Equipment: Milpitas, United States
Available date: Currently Available
ASM AB530 Automatic Wire Bonder, Model AB530, with Olympus SMZ-140 microscope
ASM AB530 Automatic Ultrasonic Wedge Bonder
Applications : Chip-on-board, multi-die / multi-PCB, high lead count, etc
High speed bonding
Fine pitch capability for advanced packages
Cost saving by widely implementing linear and DDR motor systems
Multi-unit / multi-PCB bonding capabilities
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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