Macquarie Semiconductor and Technology on behalf of Qorvo US, Inc.
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Teikoku Taping System Co., Ltd.
Date of Manufacture:
Currently Configured for: 200mm
Current Equipment Status: Available
Location of Equipment: Farmers Branch, United States
Available date: Currently Available
4” and 6” Wafer Fully Automatic PET Cover Film Remover c/w the following
2.1 Main System Frame c/w Two TTS Original Cassette Station
2.2 Adhesive Tape Remove Type
2.3 Ceramic Vacuum Chuck Remove Table
2.4 Normal Vacuum Finger
- (Special Design Micro Bernoulli Finger Future Upgradable)
2.5 Programmable Removing Speed, Angle and Notch direction
2.6 Recipe Storage Capacity: 10
2.7 ESD Fan Unit
2.9 HEPA Filter Mini-Environment(Applicable for Class 10)
2.10 Wafer Press Module for Warped Wafer
-
Audit to Verify
Reference :
DXR2-800 Standalone Tape Remover for 8 inch
Just to name a few of the multiple functions available on the TTS Tape Removing tools: -Adjustable removing speed -Adjustable removing angle -Thin wafer handling -Inline UV Irradiation System
The UV tape removal feature provides Auto UV Intensity Calibration. UV exposure provided by LED which provides better uptime due to longer LED lifetime
Applicable Wafer Size : 4, 5, 6 and 8 inch
Selectable Removing Type : Sticky or Heat Seal
Inline UV Irradiation Lamp Type : LED
Utilities
Dimensions(W x D xH) : 1250 x 1400 x 2000 mm / 50 x 55 x 79 inch
Weight : Approx. 600Kg / 1350Lbs
Power : 200 - 240V, Single Phase
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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