Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

Zen Voce Corporation BM388

Asset ID: 41200

Print spec sheet

Zen Voce Corporation


Solder Ball Mount

Ball Mount

Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available


Feature :

  • High Speed Linear Pick & Place Robots
  • Theta axis on stage for precise flux and ball position
  • Application both of carrier & substrate type ball mount process
  • Z axis height precise position by motorized lifter
  • Substrate placement press module
  • Max 15mm warpage substrate available
  • Substrate orientation inspection thru vision (PMI, Carrier type)
  • Rock & fill ball bin module
  • Tool damage protection feature using Quickstop
  • Highly flexible system with user friendly GUI
  • Variable speed control for Flux & Ball sweep with software parameter setting (beneficial for process evaluation)


Length min 150min ~ max 325mm

Width min 50min ~ max 170mm

Placement area (Length) max 320mm

Placement area (Width) max 130mm

Thickness min 1mm ~ max 8mm

Ball size min 0.30mm ~ 0.76mm and above

Ball Pitch min 0.50mm ~ 1.50mm and above


Length min 150min ~ max 300mm

Width min 50min ~ max 100mm

Placement area (Length) min 140mm ~ max 290mm

Placement area (Width) min 45mm ~ max 95mm

Thickness min 0.5mm ~ max 2mm

Ball size min 0.15mm ~ 0.76mm and above

Ball Pitch min 0.30mm ~ 1.50mm and above

Achievable number of balls per mount cycle 60,000 balls

PMI resolution 0.020mm/pixel (Option 0.014mm/pixel)

Vision accuracy +-0.03mm@3sigma

Ball placement accuracy 1/3 ball offset

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