Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

Disco Hi-Tec DFL7160

Asset ID: 210854

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Disco Hi-Tec

DFL7160

Laser Saw

Sawing

Equipment details:

Date of Manufacture: 2018

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available


DSL7160-0004- on production

DSL7160-0005- on production

DSL7160-0007- de-installed & store at warehouse area (unpacked)


Wavelength of Laser: 355 nm (Type A & Type A2)

Laser Make/ Model: DISCO/ Type A 

Lifespan of laser: used more than 3 years


DFL7160 3 Q'ty

Fully Automatic Laser Saw

  • DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing.
  • This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.
  • Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism.

*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface



Specifications

SpecificationUnit
Processing method-Ablation
Max. workpiece sizemmΦ300
X-axis
(Chuck table)
Processing rangemm310
Moving speedmm/s0.1 ~ 600
Y-axis
(Chuck table)
Processing rangemm310
Index stepmm0.0001
Positioning accuracymm0.003/310
(Single error) 0.002/5
Z-axisMoving resolutionmm0.00005
Repeatability accuracymm0.002
θ-axis
(Chuck table)
Max. rotating angledeg380
Machine dimensions (W×D×H)mm1,200 × 1,550 × 1,800
Machine weightkgApprox. 1,750


*Product appearance, features, specifications, and other details may change due to technical modifications.

*Please read the standard specification sheet thoroughly before use.

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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