Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (VA)

Dainippon Screen Mfg. Co. (DNS) SS-3000

Asset ID: 8243

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Dainippon Screen Mfg. Co. (DNS)

SS-3000

Wafer Scrubber

Etch/Clean - Wet Processing

Equipment details:

Date of Manufacture: Jan/2006

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Manassas, United States

Available date: Currently Available

• Currently Configured for 300mm wafer sizes
• MFG Date: Jan 2006
• Cassette Interface (FOUP Station):
o (3) 300mm FOUP Load-Ports
?? Shinko Electric SELOP12F25-S301010
o Entegris F300 FOUPs
o Wafer Pitch: Standard full pitch
o Overhead Transport Interface (OHT)
o E84 Parallel I/O Sensors
o E99 Carrier ID Reader
o RF Tag Readers: Omron Tiris
• Main System:
o System Type: DI System (All Teflon DI fluid flow)
o Indexer: (1) Kawasaki TS-310-D512S
?? DNS PN: 2-39-72838
o Indexer: (1) YaskawaXU-ACT1531
o Main System Robot: Kawasaki TS-520-D512S
?? DNS PN: 2-39-81303
o Main Controller
?? Original OS: Win-2000 Server, upgraded to Vista
o Host Controller
?? Original OS: Win-2000 Pro, upgraded to Vista
?? Micron Host Interface: TAR 1.5 compliant
o (2) USB 2.0 ports
o Integrated Particle Enclosure (mini-environment)
o User Interface
• System Safety:
o FM4910 Compliant (<1% by weight non-FM plastics total)
o Fire Extinguisher
o LOTO: LOTO for all Gas/Chem lines
o Safety Labels: English (includes Semi-S2 labeling on all plumbing lines)
o Leak Detection Controller & Sensors: Recirculation, Fac AOV, Chem Demand off.
?? Sensor PN: 2-39-78021
?? Controller PN: 2-39-77979
o EPO: Twist-to-Release
o Exhaust Interlocks: Chemical Dispense Stops
• Main Chemicals:
o BCD I/F #3: TMAH
?? Flow Rate: 5-10mLPM (needle valve controlled)
o BCD I/F #4: DI (H2O) – Cold
?? Flow Rate: 300mLPM (needle valve controlled)
o Filter Housing: Mykrolis QCDV ATX TH-M
• Process Module 1/2/3/4:
o Mechanical Chuck (Magnetic), 3000RPM limit
o Nozzles: TMAH, DIW
o Front-Side:
?? Rinse: Cold DIW
?? Position: Center of Wafer
?? Max Flow: 1000mL/Min
o Back-Side:
?? Rinse: Cold DIW
?? Max Flow: 500mL/Min
o Nano Spray:
?? N2 Rate: 10-100LPM (MFC Controlled)
?? N2 Filter: Mykrolis WGMX-MBX-S3
?? Rinse: Cold DIW
?? DIW Max Flow: 20-200mLPM (needle valve controlled)
o Scanning: Reciprocating in range of wafer diameter
o Working Distance: 10mm from Wafer Surface
o Lower Cup Material: PP
o Back-Side Rinse VAT Material: PVC
o Material Body: PTFE
o Wetted Surface: PTFE, PFA
o Brush:
?? Scrubbing System Included
?? PVA Brush Included
?? Scan Range: Wafer to Edge
• Note: PM-1&2 have Bevel Brush
?? Scan Speed: 5-150mm/s
?? Pressure Control: 10-80grams
?? Rotation Control: 0-267RPM
?? Cleaning System: Max 1LPM
o E-Flow CO2 System
o Alkali Drain Line: BWW / 1W (Air/Water separation)
o Alkali Exhaust Line
o Exhaust Control: Manual
• Reverser Unit:
o Wafer Flipping assembly included
o Drive Type: Pneumatic
o Wafer Sensor: Optical Photo Sensor
• Facilities:
o Move-In Restrictions: W-2600, D=1350, H=2680
o Adjuster Plate: SS (304) (#6, 100mmx100mm & #6, 200mmx200mm
o Seismic Support
o Mylar Floor System Template
o Pneumatic Chemical Supply Interface
o Exhaust Interface: Bottom
o Chemical Line Connections: Bottom (C.S.S.)

Product images

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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