Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
Date of Manufacture: 2006
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan City, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
Wafer Size: Comply with SEMI M1.15 300mm
Utility Outlet: Vertical downward
Carrier Station Block
Carrier Stage Height: 900 mm (Comply with SEMI E15.1)
Wafer Transport Method: Robotics transport method (X, Y, Z, Theta)
Sensor Placement Sensor: Monitoring carrier to be set correctly.
Presence Sensor: Monitoring presence/absence of carrier on load port.
Mapping Sensor: Checking wafers position in carrier.
Wafer Out Sensor: Detecting wafers out from carrier.
Wafer Sensor: Detecting presence/absence of wafer on fork and also wafers out from fork.
Load Port Specifications: BOLTS/Light (Comply with SEMI E92)
Loadport Lockout Pin (SEMI E1.9): FEOL
Loadport Indicator: LED for displaying conditions installed for each load port. (Comply with customer request about Color/Location.)
Operator Access Switch: Operator access switch installed for each load port.
FOUP Type: 25 Wafers
Kinematic Coupling Pin (SEMI E57): TEL standard specification.
Independent Clamp: Carrier Fixing at Undock Position
Keyboard / Trackball: None
Fan Filter Unit (FFU): Fan filter unit is installed.
OHT Type: SHINKO Electric (ASYST SHINKO)
SEMI E84 Photo I/O Sensor: TEL provides connection ports for Photo I/O Sensor on the top of CSB. Customer provides Photo I/O Sensor.
ES Switch Terminal Block: Refer to Customer Special Specifications
Curtain Sensor: None
Carrier ID Reader: Capable of Carrier ID Reader
Preparation of ID Reader: Refer to Customer Special Specifications
Scrubber Process Station
*Wafer holdong method : 6 pins edge contact method
*Wafer fixing method : 3 points grip method
*Wafer sensor : Transmission sensor detects a wafer on the chuck and checks if the wafer is held horizontally.
*Backside liquid contact prevention : N2 purge on back side.
Rotation Speed: CH2-1,CH2-2 0, 10 to 3,000 rpm (1 rpm Increment) , CH2-3,CH2-4 0, 10 to 4,000 rpm (1 rpm Increment)
Acceleration: 100 to 1,000 rpm (100 rpm/sec Increment)
Dual Band Monitoring for Rotation Rate:
Double Monitoring Function for Rotation Rate (Set in Recipe)
*Alarm rpm Bandwidth (Alarm Only) and Stop rpm Bandwidth (Station Process Stop)
*Alarm/Stop rpm Setting Range : +/- 0 to 1,000 rpm "
Process Recipes: 1000 Recipes (Total of spin stations)
Recipe Steps: 100 Steps
Process Time Setting: 0 to 999.9 sec/step (0.1 sec Increment)
Arm1: Brush (Automatic Brush Pressure Controller Function)
Brush Type: PVA + PP
Rotation Speed: In process: 100rpm, Standby: 70rpm ,Spin direction control: None
Spray Nozzle Type: AS? (Atomized Spray ?)
Flow Ranges (N2): 20 ? 100 L/min(nor) (Recipe Control by MFC)
Basic Setting (D.I.W.): 0.2 L/min
Back Rinse Nozzle: None
Side Rinse Nozzle: 2 Nozzles
D.I.W. Retention Prevention: Slow leak in each nozzle standby
D.I.W. Filter: ABUZ0LEM1(0.05?m), Entegris
Rinse Nozzle Purge Method: Slow Leak Method
ULPA Filter: Installed onto the outlet air comes out.
AC POWER BOX
Customer Power Supply Voltage: 208V
Type of Terminal for Main Breaker: round shape terminal
Cable Outlet (Primary-side): Rear
Cable Outlet (Secondary-side): Rear
ALarm Lamp/Location: Present (1 piece: Location - Upper part of Carrier Station)
Lamp Type 1st one (From the top): Red
Lamp Type 2st one (From the top): Blue
Lamp Type 3st one (From the top): yellow
Lamp Type 4st one (From the top): Green
Online Communication Method: HSMS
CCD Camera: Present
Spinner Internal Lighting: Present
Drain: Direct Drain
Exhaust Monitor: Digital Manometer (0 ? 500 Pa)
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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