Ebara FREX300 Tungsten

Equipment details:

Date of Manufacture: 2002

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Tainan 744, Taiwan

Available date: Currently Available

The equipment use of destructive methods to deinstallation the equipment.

Damage/Missing parts list, please inspect tool to reconfirm.

Dry pumps and customer provided items not included on sales

Inspect to confirm configuration and condition.

Install Type：Stand Alone

Number of Cassette / FOUP Positions is 4

Electrical Requirements：208V

SECS/GEM

No SECS II

No OEM Audit Available

Can't Produce Wafers AS IS

Signal Lamp Tower

No Clean Room Manuals

No Standard Manuals

Process

Head Type：AI G2(Right) AI G2(Left)

Platen Type：Stainless Steel(Right)/Stainless Steel(Left) 

Platen Pad Conditioner

ELF=Extra-low force：Scan Dresser(Right)/Scan Dresser(Left) 

Slurry Delivery：Closed Loop(Right)/Closed Loop(Left)

Wafer Loss Camera：No(Right)/No(Left)

Wafer Slip-Out Sensor：No(Right)/No(Left)

Atomizer：Yes(Right)/Yes(Left)

Endpoint

Table Current Monitor (TCM)：No(Right)/No(Left)

S-OPM Optical EPM ME10：Yes(Right)/Yes(Left)

Multi Process Monitor ME20 for EPD：No(Right)/No(Left)

R-ECM Eddy Current EPD：No(Right)/No(Left)

Cleaner 1 Type：Roller Brush(Right)/Roller Brush(Left)

   Megasonic：Yes(Right)/Yes(Left)

   Chemical Line 1：Yes(Right)/Yes(Left)

   Chemical Line 2：Yes(Right)/Yes(Left)

Spin Rinse Dryer：Pencil BrushYes(Right)/Pencil Brush(Left)

Nova Type is NAt

Robot controller is Miss

Motor Driver is Damage

Cleaner Roller module is Damage

Touch Screen is Miss

Head motor is Damage

Platen driver is Damage