Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)

Applied Materials (AMAT) Centura AP DPS AdvantEdge G2 Poly - Chamber Only

Asset ID: 209821

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Applied Materials (AMAT)

Centura AP DPS AdvantEdge G2 Poly - Chamber Only

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture:

Currently Configured for: To be determined

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: Currently Available

DRY ETCH 15-3AMAT_CENG2_PLY_03 AMAT CENG2 POLY


ONE CHAMBER C ONLY. IT IS JUST PLASTIC-WRAPPED UP.

no missing or damaged parts.


CONFIGURATION FOR CHAMBER C:


[Chamber C]

Chamber type:AdvantEdge G2

Gas config.(sccm)=MFC full scale

HBR(400/CL2(50)/CL2(400)/O2(10)/O2(100)/

HE(400)/N2(200)/SF6(200)/CF4(200)/Ar(400)

Source 13.56MHz, max 3000 W

Bias 13.56MHz Hz, max  1500 W

Lid Temp Control ~95

ESC Temp Control ~85

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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