ASML TWINSCAN XT:400F

Equipment details:

Date of Manufacture: 2007-04-01

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Tool config is based on original PO, please verify tool details at tool inspection

Param: T400BC7500

Serial Number: 5812

Model: 400F

2 Sided IFM-beams for WS-X (expose): Not available

2 Sided IFM-beams for WS-X (measure): Not available

2D Barcode Reader: Absent

2D grid correction: Disabled

AA processing rack: MPCR processing rack

Active wafer release for dry WS: FALSE

Air Gauge: Absent

Air Gauge Improved Levelling: Absent

ALE 1 Use: Lens heating only

Alignment Camera Mirror: Absent

Alignment laser configuration: 2 color laser

Alignment Sensor Type: Athena Narrow Marks OM

Allow different Exp: Absent

Allow even orders usage: Absent

Allow L1L7 Type 1 Optimization: Absent

Allow wafer plane deviation check with Focus Monitoring: Disabled

Application Type: Scanner Application

Assure System Snapshots: Assure System Snapshots not allowed

Ast offset correction in TIS LHFB/LOCO (Version 3): Enabled

Athena Focus Improvements 1: Absent

Athena Narrow Marks Twinscan: Present

Attenuator Type: Discrete 16 Transmissions

Automated DOE Exchanger: Absent

Automated DOE Exchanger Architecture: 5 slots MIP Control

Automated Lens Heating Calibration: Disabled

Automated Reticle Transport System: Absent

Automatic CUA: Absent

Automatic CUA exchanger architecture: Not applicable

Automatic PCE exchanger: Absent

Avoid Track INPUT/OUTPUT conflicts: Avoid Track INPUT/OUTPUT conflicts enabled

BALE Type: Dont Care

BaseLiner focus control.: BaseLiner-Focus application is disabled.

BaseLiner focus high order intrafield: BaseLiner-Focus high order intrafield is disabled.

BaseLiner overlay control.: BaseLiner-Overlay application is disabled.

Beam Control: None

board configuration: ODB + ADB

Bubble Extraction Seal Setting: Not Applicable

Capacitive z-height sensor type.: Extended Z sensor board

Carrier Handler Type: Mark II 300 Foup

CDC: Enabled

Changed Short Stroke diff XY controller: Disabled

Choice of avoidance routing.: Absent

Chuck 1 wafer size: 300mm

Chuck 2 wafer size: 300mm

Chuck Dedication: Basic

Circuit Dependent FEC: Absent

Clean Air Configuration: Others

Clean Air Temperature Control: Driver and ACC

Closing disk type: No closing disk present

Combined stage alignment: Disabled

Constrained fit: Disabled

Continuous clampable wafer table for dry WS: Absent

CT Miscellaneous Rack: Present

Data collection not covered by FOCUS and OVERLAY: InformPro Data Collection disabled.

Depolarizer type: not applicable

Describes at what plane the BMU measures: Not applicable for uv systems

Determination of NA ellipticity: Disabled

Diaphragm Limiter: Absent

Diff pressure correction for IFM beams: Absent

Docking wheels at WH unload: Absent

Dose Intensity Optimization: Disable Dose Intensity Optimization;

Dose System Performance Test for Lithoguide: Absent

Dosecontrol Hardware: ISB

DOSEMAPPER: Absent

DoseSystemPerformanceTest sequence: Test sequence 0

DOSE_MAPPER_1: Absent

Double TIS scan: Disabled

DUV Lightsource Power Level: Not applicable

Dynamic Performance Calculation: Mark 1

E-chuck Flatness Qualification Test: Disabled

EDA Interface: Disabled

EFESE: Absent

Enable the Maintenance Assistant: Disable Maintenance Assistant

Enable to support SMASH XY mark types.: SMASH XY marks are not supported.

Energy Sensor: CrismaTec

Enhanced Exposure Overlay: Absent

Enhanced exposures 1: Absent

Enhanced Throughput Reticle Alignment: Present

Enhancements in Reticle Monitor: no enhancements

Equipment Constants via SECS interface: Enabled

Exchangeable Last Lens Element: Absent

Exchangeable Pupil Lens Element: Absent

Extend IRIS maximum particles scanned to 50000.: Absent

extended docking interface at Prealigner: ECC_0MM

Extended LS areas: Disabled

Extended Spot Sensor Matching: Absent

Extended Zone Alignment: Disabled

Extreme Clean Humiditied Air: Absent

Field width optimised leveling: Disabled

FOCAL Measurement for Lithoguide: Absent

Focus Data Collection: Absent

Focus Monitoring: Present

FSM Flexibility package: Disabled

Functional use of Active Elements: No AE element

Gas Control Unit Type: High Flow (HF)

Gridmapper: Disabled

Ifm config at measure side.: 7 axes

IFM Laser Configuration: AOM Recombo Laser

ILIAS Functionality For Lithoguide: Absent

ILIAS lens setup: Absent

ILIAS Sensor Location: Absent

ILIAS sensor type chuck 1: None

ILIAS sensor type chuck 2: Zernike only

Illumination modes: All illumination modes

Illuminator platform: Aerial 1

Illuminator Type: 39

Imaging Control Rack Configuration: IMCR

Imaging Electronics Architecture: B Architecture

Imaging Fading Control: Disabled

Imaging Generic Power Amplifier: Ten Axis Power Amplifier

Immersion: Absent

Immersion Hood version: Absent

Improved Contrast Control: Absent

Improved Edge Field Leveling: Disabled

Improved Maintenance action scheduling.: Disabled

Improved wafer reject mode: Disabled

Improvements for reticle handling: Disabled

In situ Wafer Table Stone Cleaning: Absent

Indication what kind of AM controller hardware is present: SUCR

Inlet restriction for clean air: Absent

Insert a delay time before starting a Lot (lens heating).: Disabled

Integrated Reticle Inspection System: PPD1 with IRIS1 functionality.

Integrated Reticle Inspection System Configuration.: Disable creation of OSIRIS viewable files.

Integrated Reticle Library: IRL with original functionality

Intensity Calibration Per DOE: Disabled

Interferometer axis version at exposure: 3 plus 1 axis

Interferometer Electronics: Ifsr

Intrafield Higher Order Process Corrections: Disabled

Iris feature Scan: Absent

Is NA accuracy measurement allowed?: Disabled

ISIS Functionality For Lithoguide: Absent

Laminar Bottom Hood: Absent

Laser Gas Life eXtension: Disable Laser Gas Life eXtension;

Layout Version Number TIS Plate 1 on Chuck 1: TIS Plate 1 Layout Version 4

Layout Version Number TIS Plate 1 on Chuck 2: TIS Plate 1 Layout Version 4

Layout Version Number TIS Plate 2 on Chuck 1: TIS Plate 2 Layout Version 4

Layout Version Number TIS Plate 2 on Chuck 2: TIS Plate 2 Layout Version 4

LCI WaitWatcher plug-in: Absent

LCW Circuit set-up: Flow Version 1

LEC Rack in Electronic Architecture: Absent

Lens Circuit Water Flow: Normal

Lens Heating Feedback: Absent

Lens Top Tool Connection: Lens Top Tool can be mounted on top of the Lens

Lens Type: 41

Level Sensor Processing Rack: MPCR

Leveling Verification Test for Lithoguide: Absent

Levelling throughput improvement on measure side: No levelling throughput package

Light-source Architecture: HG Lamp

Light-source Type: Lamp

Light-source Wave-length: 365nm

Lithoguide Imaging Recipes: Absent

Log missed translations: Disabled

Lot Alignment Report Encryption: Unencrypted

Lot Correction Sequence: Type B

Lot Overhead Reduction: LOR2

Lot Report Data Category: Enhanced Diagnostics

LS focus node: LS focus node 1

LS spot coverage: Absent

LS_CPU_CONFIG: 2 CPUs available

LS_PEMM_CONFIG: Present

Machine: 5812

Machine Architecture: XT Machine Architecture

Machine Location: Customer Site

Machine Specification: F Specification

Machine Type: 400

Max alignment speed: Setting 2

Maximum Reticle ID Length: 24 Characters

mbds control: Present

MDL Viewer: Site View

Method for alignment of the laser beam: Not applicable for UV systems

Metroframe Circuit Water Cabinet: Absent

Metroframe type: TYPE_A

Modelling for MAXYS: Absent

Motor Circuit Water Flow: Normal

Multifunction Active Lens Element: 0

Multifunctional Active Elements: 0

Multilingual UI: Absent

NA Control Architecture: NA2 Torlon

NA Control Type: 39

NA1 motor type: None

Nitrogen Purge Utility Control: Absent

Nitrogen purging of Reticle Stage: RS is not purged

Number of Active Elements: 0

Number of Active Lens Elements: 0

Number of Active Manipulator Elements: 0

Number of Bi-directional Active Lens Elements: 0

Number of EXLE elements: 0

Number of Half Dome Mirrors: 0

Number of Lens NEXZ Manipulators: 0

Number of Lens Z Manipulators Using Camdisk: 2

Number of manipulable ELLE axes: 0

Number of Motion Controllers: 5 Motion Controllers present

Number of pre-amps available per Z-manipulator: 1

Number of RMCS clients: No clients

Number of Rxm: 0

Number of Rym: 0

Number of Semi-Active X-Y Lens Manipulators: 0

Number of Z Lens Manipulators: 2

OADB Improved Dynamic Range: Disabled

Off-axis slit: Projection lens has no off-axis slit.

Online Lamp Peak: Disable Online Lamp Peak;

Overlay Data Collection: Overlay Data Collection disabled.

Overlay Node: Level 5

Parameter indicates how long overlay data will be stored.: Short retention period.

Particle Extraction Mass Flow Meter: Absent

Patch strategy: Patchlevel

Pattern Matcher: Absent

PCE Location: not applicable

PDOC quality indicator check: PDOC quality indicator functionality is absent

PED control mode: Absent

PEP Image Streaming: Absent

PEP-ADC Intensity: Disable PEP-ADC Intensity;

Performance Enhancement Package: 1

Piezo Active Lens Mounts: Absent

Point-to-Point LS Machine Matching: Disabled

Polarization: Absent

Polarization Shaping Element Retractor: No PSER hardware installed in the machine

Polarized illumination amorph DOE.: Only unpolarized illumination.

Position Control Motion Control rack: MPCR

Position Control Power Rack Configuration: TYPE_4

Position of Spot Sensor on Chuck 1: Spot Sensor Position on Chuck 1 layout 1

Position of Spot Sensor on Chuck 2: Spot Sensor Position on Chuck 2 layout 1

Pressure update rate for fringelength correction: Pressure update rate 2 or 4 Hz

Process Dependent Gain Correction: Absent

Projection GPA Configuration Version: Version 2

Proximity Matching: Absent

PSE Location: not applicable

PUPICOM: Absent

PUPICOM Architecture: DC Motor

PUPIL Measurement For Lithoguide: Absent

Pupil measurements with ILIAS: Absent

Pupil qualification method: Centre of gravity method

Pupil TIS angular sensitivity calibration and correction: TIS Pupil Measurement will not be improved

Purge Hoods configuration: Absent

purging configuration: purging CONFIG 1

Readout location of Pneumatic Facility Unit sensors: CT sensor board (CTS)

Recipe Creator: Light

Reduced capture range for TIS scans: Disable reduced range TIS scan scenarios

Relative direction of ws to rs on the X axis: Same

REMA architecture: REMA C

Reorder Lot Service: Present

Reticle Align High Precision: Absent

Reticle Balance Mass 1 amp.: 450V20A: PAAC AT-pepD

Reticle Balance Mass 2 amp.: 450V20A: PAAC AT-pepD

Reticle Carrier Location: Right

Reticle Carrier Tag Reader: Present

Reticle exchange type: Retex option

Reticle Handler type: RH Mark III

Reticle Level Polarization Sensor: Absent

Reticle shape correction: Disabled

Reticle Size: 6 inch

Reticle Stage Chuck Type: TYPE_4

Reticle Stage Lenscooler Box: Lenscooler Box with anti-aliasing Filter

Reticle Stage Long Stroke Config: TYPE_5:CoFe_18 motor SIOB controlled int. vacuum supply magn. GC

Reticle Stage Long Stroke Motor Type: Cobalt Ferro 18 teeth

Reticle Stage Long Stroke Y11 amp.: 450V20A: PAAC AT-pepD

Reticle Stage Long Stroke Y12 amp.: 450V20A: PAAC AT-pepD

Reticle Stage Long Stroke Y21 amp.: 450V20A: PAAC AT-pepD

Reticle Stage Long Stroke Y22 amp.: 450V20A: PAAC AT-pepD

Reticle Stage Measurement System on Scan: Heidenhain Encoders

Reticle Stage purged mini environment: Absent

Reticle Stage Short Stroke X amp.: PADC 100V/18A

Reticle Stage Short Stroke Y11 amp.: PADC 100V/18A

Reticle Stage Short Stroke Y12 amp.: PADC 100V/18A

Reticle Stage Short Stroke Y21 amp.: PADC 100V/18A

Reticle Stage Short Stroke Y22 amp.: PADC 100V/18A

Reticle Stage Short Stroke Z1 amp.: PADC 100V/18A

Reticle Stage Short Stroke Z2 amp.: PADC 100V/18A

Reticle Stage Short Stroke Z3 amp.: PADC 100V/18A

Reticle streaming: Disabled

Reticle streaming lite: Disabled

RS Object Field: Normal

SAMOS Stray Light Test For Lithoguide: Absent

SASO robustness and fiber connectivity: Disable SASO robustness

Save throughput data to the disk: Disabled

Scanning Energy Sensor Calibration: Static Energy Sensor Calibration

Settle time reduction to improve the throughput: Dont care

Setup sensor board version: Setup SSD not available

Shot Data Collection: Present

SMASH Reuse Capture Information in Stage Alignment: Coarse capture scans are done on all stage alignment marks.

Smooth Field Uniformity: Absent

Specifies chuck1 config: Dry

Specifies chuck1 layout relev. for Immersion: Chuck does not support immersion

Specifies chuck1 version: not specified

Specifies chuck2 config: Dry

Specifies chuck2 layout relev. for Immersion: Chuck does not support immersion

Specifies chuck2 version: not specified

Specifies which mark types are supported: ASML marks only

SPM temp correction for lens axis: Disabled

Spot Sensor Chuck 1: CrismaTec

Spot Sensor Chuck 2: CrismaTec

Spot Sensor Reticle Stage: Absent

Stage Alignment Filter: Absent

Stages Sample Rate: 5.0 kHz

Stand-alone Workstation: FALSE

Symmetrical Reticle Alignment: Disabled

Test Table: Absent

Test table architecture: Aerial 2

Test Table Z Axis: Worm Wheel

THFFC FDE model lens dependent: Disabled

TIS diffuser: TIS diffuser absent

TIS plate deformation correction: Disabled

TOP HD: Absent

Track Pre-warning signal (APR): APR enabled

Type: 400F

Type of Air Gauge: No Air Gauge device present

Type of immersion hood for immersion: None

Type of projection multiplexer board: MUX Absent

Type of wafertable on chuck 1 for immersion machine: Zerodur version 1

Type of wafertable on chuck 2 for immersion machine: Zerodur version 1

Ultra Pure Water flow controller (WICC): absent

UNICOM: Absent

UNICOM Architecture: 1 Motor

Uniformity Improvement Package: Absent

Universal Prealignment: Disabled

Usage of Energy Sensor data by TIS: Disabled

Usage of wavelength data by TIS: Disabled

Use Sigma Calibration: no Sigma Calibration

Use Sigma WIP Preserving Offsets: no Sigma WIP Preserving Offsets

Use validity ranges around UIP data when Enabled.: Use exact matching for UIP data

UV Shutter version: UV Shutter version 3

Version of RS/WS IO library: Version 1

Wafer Carrier Location: Right

Wafer Handler Productivity: Wafer Handler Productivity Level 1

Wafer Handler wrt BF Shifted in Z: Not Shifted

Wafer Handling Load Robot Type: Double Fold Arm 12 mm Z stroke

Wafer Handling Pneumatics: Standard

Wafer Handling Unload Robot Type: Double Fold Arm 12 mm Z stroke

Wafer Id Reader: Absent

Wafer Mark Sensor: Absent

Wafer Size: 300mm

Wafer Stage Balance Mass 11 amp.: Dont care

Wafer Stage Balance Mass 12 amp.: Dont care

Wafer Stage Balance Mass 21 amp.: Dont care

Wafer Stage Balance Mass 22 amp.: Dont care

Wafer Stage Configuration: Wafer Stage type 3 configuration

Wafer Stage Fast Stiff X Move Electronics: Present

Wafer Stage Long Stroke E CS amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke E X amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke E Y1 amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke E Y2 amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke M CS amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke M X amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke M Y1 amp.: 450V20A: PAAC AT-pepD

Wafer Stage Long Stroke M Y2 amp.: 450V20A: PAAC AT-pepD

Wafer Stage Mirror Block Down Electronics: Absent

Wafer Stage Short Stroke 1 XY1 amp.: PADC 100V/18A

Wafer Stage Short Stroke 1 XY2 amp.: PADC 100V/18A

Wafer Stage Short Stroke 1 XY3 amp.: PADC 100V/18A

Wafer Stage Short Stroke 1 Z1 amp.: PADC 100V/18A

Wafer Stage Short Stroke 1 Z2 amp.: PADC 100V/18A

Wafer Stage Short Stroke 1 Z3 amp.: PADC 100V/18A

Wafer Stage Short Stroke 2 XY1 amp.: PADC 100V/18A

Wafer Stage Short Stroke 2 XY2 amp.: PADC 100V/18A

Wafer Stage Short Stroke 2 XY3 amp.: PADC 100V/18A

Wafer Stage Short Stroke 2 Z1 amp.: PADC 100V/18A

Wafer Stage Short Stroke 2 Z2 amp.: PADC 100V/18A

Wafer Stage Short Stroke 2 Z3 amp.: PADC 100V/18A

Wafer Stage Type: Dual Chuck

Wafer Switch: Absent

Wafer Track: Present

Wafers per Carrier: 25

Wavelength Adjustable: Fixed

Wet Imaging Control Cabinet: Not Applicable

WH Robot Power Amplifier: CPM 20

WS Balance Mass: Stainless Steel

WS Immersion Hood Only Testrig: Absent

WS Immersion throughput package: None

XML Lot Report Content Level: Basic

XML output for LITHOGUIDE: Disabled

XT Architecture Revision: Rev2

ZERO Fiducial: ILIAS

Zeroing type for Encoders Measurement System: Using reference marks on the encoder scales

Zoom Axicon Architecture: ZA

Zoom Axicon Type: 39

Alignment Recipe Override: Alignment Recipe Override Disabled

Alignment Strategy ID Standard or Extended. Protected.: Alignment Strategy ID max length is 15 characters

Application Specific Lens Heating Calibration and Verification: Present

BaseLiner overlay high order intrafield: BaseLiner-Overlay high order intrafield is disabled.

CP 1A: Present

CP 1B: Absent

CP 2: Present

CP 3: Present

CP 4: Present

CP 5: Absent

CP 6: Absent

Docking plate height: Low

Extended X width masking range: Disabled

Fading Control Switch: Disabled

Fresnel corrections for WSSS: Disabled

Improve robustness DPCM mark: Disable DPCM mark robustness improvement

Integrated Reticle Inspection System Clipped Status: PPD2_1 System;

Lens heating History in LH Feedforward: Disabled

Level sensor Ry drift correction: Disabled

Lower Docking Plate: Present

Maximum numerical aperature (NA) that can be used in Lot Production: level 0

NEXZ-tilt per exposure: The NEXZ-tilt cannot be adjusted per exposure.

Pattern Matcher fullchip: Absent

PDO offset for EFL LS spots: Disabled.

Position Control Rack Configuration: Rack Configuration type 3

Reticle Cleaning: Absent

Safeguard to prevent loading of reticles with too wide or mispositioned pellicles: Disabled

Scan speed increase to improve the throughput: Dont care

Spotsensor surface coating: Metacolor

TestStream: TestStream disabled

Type of multi foil lens element: none

UV Shutter Optimized Open Time: Optimized UV Shutter Open Time V2

Wafer Handling Store Unit: Absent

Wafer Stress Relaxation: FALSE

WS Immersion thermal control package: None

Z-capture for low relfectivity wafers: Off

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales