Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
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Metal CVD (Chemical Vapor Deposition)
Date of Manufacture: 2007-01-01
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
Chamber Qty:3
Basic System
TM Robot: BX80-070464-11, PICK,ARM,300MM C..BR931072 (BX9507046411 (YASKAWA)
Loader Robot: BX80-000335-11, Type:LOADER ARM,CART..SBX92105903 (SHINKO)
Loader Robot Controller: BX80-000341-11, Type:CONTROLLER..SBX92304875 (SHINKO)
Dummy Port operation: Yes
Pyro,Inner: 3M87-062305-1 SENSOR ASSY,PYRO INNER W
Pyro,Outer: 3M87-062306-1 SENSOR ASSY,PYRO OUTER W
Process position: TRIAS SFD-W/SFD-W/SFD-W/SFD-W
Process capability: TRIAS SFD-W
System Software
Software Revision: V3.690R1
WaferCarryingOut: V3.690R1
CassetteJobEventEnd: V3.690R1
Process Software Revision: V3.690R1
Factory Interface System
Carrier: FOUP 25 slots cassette
Number of Load Port: 3 ( BOLTS-M)
Loader arm: Dual arm type /Taper pick
Mini-environment FFU filter: Daikin ULPA 0.1um
The number of LLM: 2
LLM bleed gas: N2
Carrier ID reader: OMRON V640-HAM11
Abatement Interface Kit: Dual type abatement
Transfer, Vaccuum, Exhaust, Cooling Water Systems
Transfer arm: Twin pick type
TM bleed gas: N2
The number of Aligner: Q'ty:1 (Located in LM)
Power Fail Endurance: NA
Pressure sensor: INFICON VSA100A
Pirani gauge (ATM switch): LEYBOLD TTR211S
Capacitance Manometer: MKS 626A02TDE
LLM1/LLM2-Door valve: SMC CBM2B40-N4640-90
LLM1/LLM2-Gate valve: V TEX I-I-00078-2-01
Flowmeter: Tokyo Flow Meter FF-MOA80-21
Remote Units
PM Dry Pump: EBARA ESR201WN
Divert Dry Pump: None
chiller: RKE3750B-VW-G1-SP
Chamber TEL TRIAS W
6.65pa capacitance gauge: MKS 627BU5TBD1B
13.33kpa capacitance gauge: MKS 626B12TBE
103kpa capacitance gauge: PURERON PC-302A-VR-15A-M
Gate Valve (Slit Valve): V TEX : IRF-07084-2-01
APC Valve: Fuji Imvac HV-50N
Vacuum valve(VEP1): SMC XLA-50A-M9NA
Pressure Gauge, exhaust system: SUNX DP-M2
Gas Box Configuration
MFC (Massflow controller) 1: MFC1 Hitachi-Metal SFC1470FAPDMC-4UGL WF6 150/450sccm
MFC (Massflow controller) 2: MFC2 Hitachi-Metal SFC1471FAMC-4UGLN ClF3 1000sccm
MFC (Massflow controller) 3: MFC3 Hitachi-Metal SFC1481FAMC-4UGL Ar-1 7000sccm
MFC (Massflow controller) 4: MFC4 Hitachi-Metal SFC1480FAPDMC-4UGL SiH4 200/800sccm
MFC (Massflow controller) 5: MFC5 Hitachi-Metal SFC1481FAPDMC-4UGL H2 2000/6000sccm
MFC (Massflow controller) 6: MFC6 Hitachi-Metal SFC1480FAMC-4UGL N2 2000sccm
MFC (Massflow controller) 7: MFC7 Hitachi-Metal SFC1481FAMC-4UGL Ar 7000sccm
MFC (Massflow controller) 8: MFC8 Hitachi-Metal SFC1480FAPDMC-4UGL H2 1000/3000sccm
MFC (Massflow controller) 9: None
Kit Parts:
Halogen lamp: MB3M46-000002-11, LAMP,TUNG HALOGEN..JID100V-500W/N
Clamp Ring: Clamp Ring 3M10-151169-11 CLAMP RING,OL2 TP5 TP10"
Chamber Kit
O-ring(Gas Inlet): 027-001031-1 Qty 3
Pyro meter(IN): MB3M87-040480-13 Qty 1
Pyro meter(OUT): MB3M87-040481-13 Qty 1
Tefron washer: 3M10-407223-12 Qty 1
O-RING(Showerhead 1): AS568A-280-8900 Qty 1
O-RING(Showerhead 2): AS568A-224-8900 Qty 2
O-RING(Showerhead 3): AS568A-278-8900 Qty 1
O-RING(Showerhead 4): AS568A-205-8900 Qty 1
O-RING(G/V): AS568A-372-8900 Qty 1
Clamp Ring: 3M10-151169-11 Qty 1
Attachment: MB3M10-101458-12 Qty 1
Lamp: MB3M46-000004-11 Qty 1
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
Triase+™ Ti/TiN is a 300mm single-wafer metal CVD system for high step coverage Ti/TiN film formation using TiCl4. Based on TEL's industry-proven Trias™ platform, since its introduction, the system provides low contact resistance film process while reducing contact leakage of various devices. Especially in high-aspect-ratio contact hole, Triase+™ SFD™ TiN has been widely adopted by using SFD™ technology that has both merits of excellent step coverage of ALD and high productivity of CVD. The Triase+™HP Ti, single-wafer metal CVD system, accommodates a lot of additional functions such as optimized surface treatments by unique showerhead gas dispersion module and simultaneous TiSix formation technology during Ti deposition. Furthermore the system provides widen temperature control range, lower particle level and higher productivity. Its unique technology addresses the various process requirements of metal deposition that having the structure such as ultra-shallow junction and nickel silicide contacts. As a successor model, Triase+™ HP Ti Plus, which allows higher step coverage for next generation devices, has also been added to the product lineup.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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