Accretech/TSK UF3000

Equipment details:

Date of Manufacture: 2006

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available

PROBE TCP-3ACCR_16PINC1D TSK UF3000 Final Probe

Other Missing or damaged parts: Not reported. Please inspect to confirm.

Loader Type: TSK

Number of Loaders: 1 Single loadport

Cassette ID Reader: Yes, KEYENCE BL-601HAC1

Chuck Size: 12"

Chuck Top Material: NICKEL COATING

Low Temp Chuck: YES, Type: ARTS-LC12

Chuck Temperature Range: -40~150℃

Temperature Unified Chuck Option: Yes

Low Noise Chuck Option: No

External Chiller Unit: Yes, SHI SCU500S

High Force Z Drive: No

Auto Probe to Pad Alignment: Yes

Needle Mark Inspection: Yes

Fail Mark Inspection: Yes

Surface Wafer ID OCR: Yes, INSIGHT 1700 series

Wafer ID Barcode Reader: No

Needle Cleaning Option (Double Brush): No

Auto Needle Height and Align: Yes, Auto/Manual card change

Soak Time Option: Yes

Probe Card Changer: Yes

3-64 Multi-site Probing: 1~1024

GPIB Interface: Yes, ACCRETECH STANDARD COMMAND

RS232 Interface: Yes

RF Tag: No

Software Version: S8.39.CM

P/C unit no.: ACCT-072

User ID / Password: Default

Integrated Printer: No

Manipulator: Hinge, MHF6000

Test System Interface: Micron C1D (tester is not included)

Tool is a Cold temperature range prober.

X,Y Overall Accuracy：±2.0µm (Temp Stability ±1℃

X,Y Stage Accuracy：±1.0µm

Z Axis Stroke(Applicable stroke)：37mm

Z Axis Control Accuracy：±2µm

Stage Durability：200kgf

Hot&COLD chuck

Chiller：SCU-600

Temp. Range：-40 to 150℃

Tool is a Right SIDE LOADER.

Tool was docked with an ?? tester.

UF3000 Standard Feature

Overall Accuracy Within 2 µm

Wafer Size 8", 12"

X/Y axis Probing Area ±170 mm (X/Y axis Probing Area)

X/Y axis Maximum Speed X axis 300 mm/s Y axis 230 mm/s

Z axis Full Stroke 37 mm

Z axis Maximum Speed 30 mm/s

θ axis Rotation Range ±5 deg.

Fine Alignment CCD ITV Image Processing

Loader Cassette Mounts 1 (2nd cassette with option)

Loader Wafer Handling Robot Arm / Backside Holding

Hard Disk 3.5" 20GB (1 unit standard)

Floppy Disk 3.5" 2HD / 2DD (1 unit standard)

MO 230 / 540MB (1 unit standard)

Display 12.1" TFT Color LCD

Power Consumption Less than 2kVA

Air Supply Source Pressure 0.6 MPa or more

Air Supply Consumption Approximately 0.1 liters / wafer

Vacuum Supply Less than -80 kPa, 30 liters / minute

Dimensions 1508W × 1587D × 987 H mm

Weight 1500 kg (Standard)