Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

BESI Datacon 2200 evo

Asset ID: 41006

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Datacon 2200 evo

Die Bonder


Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available


Key Features

High Performance at High Accuracy

  • Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
  • High productivity, low cost-of-ownership
  • Up to 4 working heads in one machine

Multi-Chip Capability

  • Single pass production for complex products
  • Die attach, flip chip, multi-chip in one machine
  • Epoxy writing & stamping, flux dipping

Unbeaten Flexibility

  • Die pick from wafer, waffle pack, gel pack, feeder
  • Die place to carrier, boat, substrate, PCB, lead frame, wafer
  • Hot and cold processes supported: epoxy, soldering, thermo-compression
  • MCM, SiP, Hybrids

Open Platform Architecture for Full Customization

  • Most advanced modular platform concept
  • Production line tailored 100% to your needs
  • Ideal solution with smallest footprint possible


Machine Capability

X/Y placement accuracy ±10 µm @ 3 sigma (7 µm on request)
Heated bond head (optional) Up to 350 °C
Bond force0 – 7,500 g (programmable)



 Die sizeDie attach 0.17 mm – 50 mm
Flip Chip 0.8 mm – 50 mm
 Die thickness0.02 mm – 7 mm
 Wafer size4" – 12"


Tape and Reel

Tape width8 mm – 44 mm


Substrates and Carriers

TypesFR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak®, JEDEC tray
Working range13" x 8"



TypesPressure/time, Volumetric (Auger-screw type), High-performance D-style pump


Adhesive and Stamping Reservoir

Epoxy thicknessSetting range 0.1 mm – 5 mm (0.004" – 0.19")


Slide Fluxer

Flux film thickness Various cavity plates available


Size and Weight*

SizeW 1,200 mm x D 1,225 mm x H 2,000 mm
Weight1,300 kg

*single module without input/output systems

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