Macquarie Equipment Trading on behalf of Micron Memory Japan, G.K. (F15)

LAM Research 2300 Exelan Flex EX+

Asset ID: 207113

Print spec sheet

LAM Research

2300 Exelan Flex EX+

Dielectric Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: 2013

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 5/28/2021

DRY ETCH 15-3LAM_EXELEXP_60_3 LAM FLEXEXP


EXELAN-Flex EX Plus[3ch]


A HARD DISK DRIVE WILL BE REMOVED FROM TOOL.

Other missing or damaged parts: Not reported.


SERIAL NUMERS

F149684 on Chamber 1

F149685 on Chamber 2

F149686 on Chamber 3


[Process Module 1]

Chamber type:Flex EX Plus

Gas config.(sccm)=MFC full scale

C4F8(50)/CF4(200)/O2(3000)/Ar(1000)/

CO(500)/CH3F(100)/O2(30)/CHF3(100)/

O2(300)/Xe(500)/C4F6(50)/CH2F2(100)/O2(10)

Source 60MHz 2500W/27MHz 3000W/2MHz 8500W

Lid Temp Control ~140℃

ESC Temp Control ~60℃


[Process Module 1]

Chamber type:Flex EX Plus

Gas config.(sccm)=MFC full scale

C4F8(50)/CF4(200)/O2(3000)/Ar(1000)/

CO(500)/CH3F(100)/O2(30)/CHF3(100)/

O2(300)/Xe(500)/C4F6(50)/CH2F2(100)/O2(10)

Source 60MHz 2500W/27MHz 3000W/2MHz 8500W

Lid Temp Control ~140℃

ESC Temp Control ~60℃


[Process Module 1]

Chamber type:Flex EX Plus

Gas config.(sccm)=MFC full scale

C4F8(50)/CF4(200)/O2(3000)/Ar(1000)/

CO(500)/CH3F(100)/O2(30)/CHF3(100)/

O2(300)/Xe(500)/C4F6(50)/CH2F2(100)/O2(10)

Source 60MHz 2500W/27MHz 3000W/2MHz 8500W

Lid Temp Control ~140℃

ESC Temp Control ~60℃

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