Macquarie Semiconductor and Technology on behalf of Qorvo Costa Rica S.R.L.
Date of Manufacture: 2017
Currently Configured for: N/A
Current Equipment Status: Available
Location of Equipment: Heredia, Costa Rica
Available date: Currently Available
TDK Corporation AFM-1505 Compact Ultrasonic Bonder
• Flexible design for the various process (Ultrasonic· Thermosonic • C4 • Thermal Compression· Eutectic • Transfer etc.)
• Process and machine proposal based on the sufficient experiences
Pre heater table
Bond heater table
Auto nozzle cleaning
Bump collapse height measurement
Bump absence detection
Bad mark detection
Wafer theta axis correction
Nozzle surface monitoring
Nozzle bonding counter
Production management data
Method : Face Down Flip Chip Bonding (Option: Face Up / High Precision Mounting)
Bonding Process : Ultrasonic· Thermosonic • C4 • Thermal Compression· Eutectic· Transfer etc.
Mounting Tact Time : MAX: 0.78sec/chip (Including 0.2sec process time)
Accuracy : ±7µm/3o (Option ±5µm,±3µm)
Max Load : 25N (Option 50N, 1 DON, 200N, 500N)
Chip Size MAX: 2.5W X 2.50 X 1.0T mm (Option MAX:20.0W X 20.00 mm)
Chip Size MIN: 0.3WX 0.3DX 0.1T mm
Chip Supply : 5-. 6, B, 12 Inch Wafer, Tray etc (Wafer magazine auto loading)
Substrate Size MAX: 180W X 120D X 3.0T mm (Option MAX: 8 inch wafer)
Substrate Size MIN: 50W X 50D X 0.3T mm
Substrate Supply : Substrate• Package Tray•Wafer Tray etc.
Machine Size : 1,200W X1 ,504D X1 ,650H mm
Machine Weight : approx. 1,800kg
Power : AC200V or AC220V 3phase 50/60Hz 30A
Compressed Air : Pressure : 0.5Mpa Consumption :approx. 30NL/min Connection: R 1/4 or Joint for 10mm tube
Vacuum : -80 kPa or more
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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