Macquarie Semiconductor and Technology on behalf of Macquarie Semiconductor and Technology Inc. Taiwan Branch - UMC
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Date of Manufacture: 2002-01-01
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Tainan 744, Taiwan
Available date: Currently Available
The equipment use of destructive methods to deinstallation the equipment.
Damage/Missing parts list, please inspect tool to reconfirm.
Dry pumps and customer provided items not included on sales
Inspect to confirm configuration and condition.
Install Type：Stand Alone
Number of Cassette / FOUP Positions is 4
No SECS II
No OEM Audit Available
Can't Produce Wafers AS IS
Signal Lamp Tower
No Clean Room Manuals
No Standard Manuals
Head Type：AI G2(Right) AI G2(Left)
Platen Type：Stainless Steel(Right)/Stainless Steel(Left)
Platen Pad Conditioner
ELF=Extra-low force：Scan Dresser(Right)/Scan Dresser(Left)
Slurry Delivery：Closed Loop(Right)/Closed Loop(Left)
Wafer Loss Camera：No(Right)/No(Left)
Wafer Slip-Out Sensor：No(Right)/No(Left)
Table Current Monitor (TCM)：No(Right)/No(Left)
S-OPM Optical EPM ME10：Yes(Right)/Yes(Left)
Multi Process Monitor ME20 for EPD：No(Right)/No(Left)
R-ECM Eddy Current EPD：No(Right)/No(Left)
Cleaner 1 Type：Roller Brush(Right)/Roller Brush(Left)
Chemical Line 1：Yes(Right)/Yes(Left)
Chemical Line 2：Yes(Right)/Yes(Left)
Spin Rinse Dryer：Pencil BrushYes(Right)/Pencil Brush(Left)
Nova Type is NAt
Robot controller is Miss
Motor Driver is Damage
Cleaner Roller module is Damage
Touch Screen is Miss
Head motor is Damage
Platen driver is Damage
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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