Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (Boise)

Applied Materials (AMAT) Centura AP DPS AdvantEdge G2 Poly - Chamber Only

Asset ID: 205967

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Applied Materials (AMAT)

Centura AP DPS AdvantEdge G2 Poly - Chamber Only

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: 2007

Currently Configured for: 300mm

Current Equipment Status: Available

Location of Equipment: Boise, United States

Available date: Currently Available

Chamber IDACG24C03B0
DescriptionG2-Poly
 Detailed DescriptionMfg Part
TMPPUMP TURBO 2700RPM ISO320/KF40 1/4FVCR PURGE 240VAC3620-00486
Source RFGEN RF 13.56 MHZ, 3.0KW PARAMOUNT 3013, 3PHASE 2080190-19021
Source RFCABLE ASSEMBLY, HN(M) TO HN(M) R/A, PULSAR 0150-04797
Source RFMATCH RF 13.56 MHZ, 1.5KW PARAMOUNT 1513, 3PHASE 208 0190-19023
Bias RF1 (13.56MHz)GEN RF 13.56 MHZ, 1.5KW PARAMOUNT 1513, 3PHASE 2080190-19022
Bias RFAE, RF MATCH, 2/13 MHZ, 20/60 A, 4 KV, B20N OUTPUT CONN 0190-19024


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