Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)

Applied Materials (AMAT) Centura AP DPS AdvantEdge G2 Poly

Asset ID: 190054

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Applied Materials (AMAT)

Centura AP DPS AdvantEdge G2 Poly

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: October 9, 2013

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: Currently Available

Tool has been de-installed and is stored in an off-site warehouse.

Shipping kits have been installed on a FI unit only. The shipping kits are required to be shipped back to Fab15.

All units are barrier-bagged and skidded.


Missing or damaged parts: Fab15 confirmed Qty 2 of RING,SINGLE STD CERAMIC (consumable items) are missing.

No other missing or damaged parts. Fab15 confirmed it.


Chiller is included in tool but pump is not.


[Chamber A]

Chamber type:AdvantEdge G2 

Gas config.(sccm)=MFC full scale

HBR(400)/CL2(50)/CL2(400)/O2(10)/

O2(100)/HE(400)/N2(200)/SF6(200)/

CF4(200)/Ar(400)

Source 13.56MHz, max 3000 W

Bias 13.56MHz Hz, max  1500 W

Lid Temp Control ~95℃

ESC Temp Control ~85℃


[Chamber B]

Chamber type:AdvantEdge G2 

Gas config.(sccm)=MFC full scale

HBR(400)/CL2(50)/CL2(400)/O2(10)/

O2(100)/HE(400)/N2(200)/SF6(200)/

CF4(200)/Ar(400)

Source 13.56MHz, max 3000 W

Bias 13.56MHz Hz, max  1500 W

Lid Temp Control ~95℃

ESC Temp Control ~85℃


Missing or damaged parts: Not reported.

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