Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Centura AP AdvantEdge G5 Metal
Etch/Ash/Clean - Plasma Processing
Date of Manufacture: 2010
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
OEM | Applied Materials | ||
Tool Model | Centura AP AdvantEdge G5 | ||
Process | Metal | ||
Software Version (include revision #) | AMS 3.5_105 | ||
System Power Rating | 208VAC 3-Phase | ||
Loading Configuration | 3 Carrier Stage |
Vendor Chm Model | Chemicals / Gases Used (not to use Micron Proprietary names) | ||||
Chm/Unit Position 1 | Centura G5 | BCL3,CL2,O2.N2,SF6,CHF3,CF4,AR | |||
Chm/Unit Position 2 | Centura G5 | BCL3,CL2,O2.N2,SF6,CHF3,CF4,AR | |||
Chm/Unit Position 3 | ASP | CF4,O2,N2 | |||
Chm/Unit Position 4 | ASP | CF4,O2,N2 |
Description | |||
Tool: | |||
Process Unit:Centura | Model:G5 | ||
Controller:FES/FIS | |||
MFC/Pressure Unit:AERA PI-980/BROOKS INSTRUMENT GF125 | |||
Drive Mechanisms:YASKAWA FI Robot | |||
FOUP Opener:refarence picture | |||
Gas System:MFC/FRC |
Missing parts: two INR-496-003D items and one INR-498-016C item.
Fab15 confirmed there were no damaged parts.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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