Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)

LAM Research 2300 Exelan Flex 45

Asset ID: 209622

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LAM Research

2300 Exelan Flex 45

Dielectric Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: 2007

Currently Configured for: To be determined

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 7/8/2022

DRY ETCH 15-3LAM_EXELAN45_OX_03 LAM XLANABE OX


OEM  LAM
Tool Model  Exelan Flex45
Process  Oxide
Software Version (include revision #) 1.8.4_SP5-HF1-Release
System Power Rating  200 AC 3-Phase
Loading Configuration  3 load ports
   Vendor Chm ModelChemicals / Gases Used (not to use Micron Proprietary names)
Chm/Unit Position   1  Flex45C4F8,CF4,O2,Ar,CO,CH3F,C4F6,CH2F2,N2
Chm/Unit Position   2  Flex45C4F8,CF4,O2,Ar,CO,CH3F,C4F6,CH2F2,N2
Chm/Unit Position   3  Flex45C4F8,CF4,O2,Ar,CO,CH3F,C4F6,CH2F2,N2


Fab15 confirmed there were no missing or damaged parts.

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