Applied Materials (AMAT) Reflexion - Dielectric

Equipment details:

Date of Manufacture: 2003

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan City, Taiwan

Available date: Currently Available

Tool config is based on original PO, please verify tool details at tool inspection

Base System

Reflexion: 4 head, 3 platen polishing system. Dry in Dry out.

Polisher Skins: Clear P1, P2, P3, and P4: Non-4910 compliant.

Gap Wash: 120 degree nozzles(Fan type)

Load Cup Wafer Exchanger: Machined SST rings

Nova 3090 Ready: None

Monitor 1 Location: Cart

Monitor 2 Location: None

Light Tower: Factory Interface and Polisher Sides

Software

Software: Reflexion VMIC rp3B6.5_31

Factory Interface: fB4.20_14 beta

ISRM / RTPC: N/A

RTPC: N/A

Interface "A": N/A

Nova 3090: N/A

Wafer to Wafer iAPC: N/A

Within Wafer iAPC: N/A

Factory Interface

FI/wet robot: Kawasaki

WIP Delivery Type: OHT/manual delivery

FOUP: N/A

OHT Light Curtain: NA

E84 PI O Sensors and Cables: UPPER E84 SENSORS & CABLES

E99 Carrier ID: N/A

Docked E99 Reading Capability: N/A

Docking Flange Shield: N/A

Frame Configuration: N/A

Load Ports: TDK TAS300

Load Port Operator Interface: STANDARD

Load Port Types: ENHANCED 25 WAFER FOUP

Operator Access Switch: Yes

Platen 1

Platen Type: STANDARD (<= 200 RPM)

Endpoint: N/A

Endpoint: N/A

High Pressure Rinse Flow Meter: 0-5 L/min

Rinse Arms: High Pressure/Flow

Flow Meter: 50-500 ml/min

Temperature Control: Platen Cooling Water

Platen 2

Platen Type: STANDARD (<= 200 RPM)

Endpoint: N/A

Endpoint: N/A

High Pressure Rinse Flow Meter: 0-5 L/min

Rinse Arms: High Pressure/Flow

Flow Meter: 50-500 ml/min

Temperature Control: Platen Cooling Water

Platen 3

Platen Type: STANDARD (<= 200 RPM)

Endpoint: NA

Endpoint: N/A

High Pressure Rinse Flow Meter: 0-5 L/min

Rinse Arms: High Pressure/Flow

Flow Meter: 50-500 ml/min

Temperature Control: Platen Cooling Water

Polisher (Polisher Unit: Slurry flow control from pump type upgraded to CLC type)

Polisher Technology: SLURRY AND PAD

Polishing Head: 5-Zone Contour CIP

Cross Break: N/A

Pad Wafer Loss Sensor: DARK PAD SENSOR

InterPlaten Clean: NO

ISRM Laser Key Switch: Yes

Slurry Delivery System: 2 x 6 CLC SDS

Head 1 Power Cable: 0150-16277

Head 2 Power Cable: 0150-16278

Head 3 Power Cable: 0150-16279

Head 4 Power Cable: 0150-16280

Head 1 Encoder Cable: 0150-16281

Head 2 Encoder Cable: 0150-16282

Head 3 Encoder Cable: 0150-16283

Head 4 Encoder Cable: 0150-16284

G4+ UPA: MKS

G4+ UPA: MKS

Cleaner Meg

MEGASONICS: One chem direct feed (FM)

Transducer: Yes

Chemical 1: 1000 ml/min

Chemical 2: N/A

Brush Box 1

Brush LDM Type: One chem direct feed (FM)

Chemical 1: 1000 ml/min

Chemical 2: N/A

Brush Box Level Spacer: N/A

Brush Box Shaft: N/A

Toe In: N/A

Slow drain: N/A

Brush Box 2

Brush LDM Type: One chem direct feed (FM)

Chemical 1: 1000 ml/min

Chemical 2: N/A

Brush Box Level Spacer: N/A

Brush Box Shaft: NA

Toe In: N/A

Slow drain: N/A

Dryer Module

Dryer Type: SRD

Recovery Module: SRD

Output Station Dampner: SRD

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales