Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Date of Manufacture: November, 2006
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 2/3/2023
Tool is operating in clean room.
Shipping brackets and kits will need to be supplied by buyer.
Missing or damaged parts: Fab15 confirmed there were no missing or damaged parts.
UPDATED CONFIGURATION:
Connected to an Agilent 4073B tester.
Temperature range: 40℃～150℃
Configured for Ambient/Hot temperatures.
To operate up to 150℃.
Chuck Type: Low Noise Chuck.
Chuck MFG: NOV-06.
Tester Interface: Connected on GP-IB between Prober and Tester.
Tool corresponds with Tester on GP-IB.
Reference :
UF3000 Standard Feature
Overall Accuracy Within 2 µm
Wafer Size 8", 12"
X/Y axis Probing Area ±170 mm (X/Y axis Probing Area)
X/Y axis Maximum Speed X axis 300 mm/s Y axis 230 mm/s
Z axis Full Stroke 37 mm
Z axis Maximum Speed 30 mm/s
θ axis Rotation Range ±5 deg.
Fine Alignment CCD ITV Image Processing
Loader Cassette Mounts 1 (2nd cassette with option)
Loader Wafer Handling Robot Arm / Backside Holding
Hard Disk 3.5" 20GB (1 unit standard)
Floppy Disk 3.5" 2HD / 2DD (1 unit standard)
MO 230 / 540MB (1 unit standard)
Display 12.1" TFT Color LCD
Power Consumption Less than 2kVA
Air Supply Source Pressure 0.6 MPa or more
Air Supply Consumption Approximately 0.1 liters / wafer
Vacuum Supply Less than -80 kPa, 30 liters / minute
Dimensions 1508W × 1587D × 987 H mm
Weight 1500 kg (Standard)
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
Get in touch
Ask about our equipment solutions, ranging from Macquarie equipment inventory sales, sourcing programs, surplus disposition options, and direct equipment purchases.