Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)

Accretech/TSK UF3000

Asset ID: 209087

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Production Wafer Prober

Wafer Prober

Equipment details:

Date of Manufacture: Oct 2006

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 11/30/2022


Configuration. Audit to verify.

Tool is a UF3000 prober.

Missing or damaged parts: Not reported. Please inspect to confirm.

Prober Feature

X,Y Overall Accuracy:±2.0µm (Temp Stability ±1℃

X,Y Stage Accuracy:±1.0µm

Z Axis Stroke(Applicable stroke):37mm

Z Axis Control Accuracy:±2µm

Stage Durability:200kgf

Hot chuck


Temp. Range:50 to 150℃

Tester model: an Agilent 4082A.

UF3000 Standard Feature

Overall Accuracy Within 2 µm

Wafer Size 8", 12"

X/Y axis Probing Area ±170 mm (X/Y axis Probing Area)

X/Y axis Maximum Speed X axis 300 mm/s Y axis 230 mm/s

Z axis Full Stroke 37 mm

Z axis Maximum Speed 30 mm/s

θ axis Rotation Range ±5 deg.

Fine Alignment CCD ITV Image Processing

Loader Cassette Mounts 1 (2nd cassette with option)

Loader Wafer Handling Robot Arm / Backside Holding

Hard Disk 3.5" 20GB (1 unit standard)

Floppy Disk 3.5" 2HD / 2DD (1 unit standard)

MO 230 / 540MB (1 unit standard)

Display 12.1" TFT Color LCD

Power Consumption Less than 2kVA

Air Supply Source Pressure 0.6 MPa or more

Air Supply Consumption Approximately 0.1 liters / wafer

Vacuum Supply Less than -80 kPa, 30 liters / minute

Dimensions 1508W × 1587D × 987 H mm

Weight 1500 kg (Standard)

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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