Macquarie Semiconductor and Technology on behalf of Qorvo Costa Rica S.R.L.
Date of Manufacture: 2011
Currently Configured for: N/A
Current Equipment Status: Available
Location of Equipment: Heredia, Costa Rica
Available date: Currently Available
TDK Corporation AFM-1503 Compact Ultrasonic Bonder
Country of Origin: Japan
Maximum Wafer Size: 8 Inches
Does NOT include computer seen on top of machine
Manufacturer Name: TDK Corporation
CE marked: NO
Type of Media Handler: WAFER
Recommended Packaging Form: CRATE
Overall:63 x 53 x 86 IN - 3527 LBS
1600.20 x 1346.20 x 2184.40 mm - 1599.85 kg
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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