Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

BESI Datacon 8800 Chameo

Asset ID: 210361

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Datacon 8800 Chameo

Flip Chip Bonder


Equipment details:

Date of Manufacture: 2010

Currently Configured for: N/A

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available

Tool config is based on original PO, please verify tool details at tool inspection

Damage/Missing parts list

Please inspect tool to reconfirm

Key Features

Multi-Chip – Combining Speed, Flexibility and Accuracy

  • Multi-chip capability – Flexibility on smallest footprint
  • Single pass is king – Improve your Cpk for multi-FC packages
  • Waffle pack feeders – Extend your possibilities
  • Extra Speed up to +40%

Enhanced Capabilities – Ready for the Future

  • Thermo-compression – No limits for your applications
  • Leadframe, strip, boat, wafer – No limits for your substrates
  • Customized features – Exactly tailored for your process
  • 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
  • Face-down & Face-up (recipe controlled)
  • Clean room class ISO 5
  • Foup load port
  • Tape & Reel

Highest Accuracy – Capturing Tomorrow’s Markets

  • Highest Accuracy ± 5 µm / 3 µm @ 3 Sigma – For fine-pitch and TSV applications
  • Local reflow – Mastering sophisticated assemblies
  • Long-term stability – Securing high yield at high speed

Wafer Level Applications

  • Fan-Out Wafer Level Packages – Highest performance for lowest cost
  • Advanced Chip to Wafer – Cost effective dual die stacking
  • Through Silicon Vias (TSV) – Entry ticket to the future


Local accuracy± 3µm @ 3 sigma
Global accuracy± 5µm @ 3 sigma
Vision system4Mpix, 6 x 6mm FOV for substrate / upwards camera
12 x 12mm for wafer camera
Strips, Boats, Panels340mm
Fluxeroption, various cavity plates available
Multi Chipincluded
UPH (dipping process)6,000
UPH (FO-WLP / no dipping)up to 9,000
Clean room classISO 5 (optionally)
Capability integrityenhanced standard
Local reflownot available
Lead time8 - 10 weeks
Bond force0.5 - 50N
Die size0.3 - 30mm
Die thickness50µm - 3mm, thinner on request
Footprint1,600 x 1,200 x 1,880mm (W x D x H) (with dual monitor)


Substrate / Strip handling

  • Input / output buffer
  • Magazine loader / unloader ML1
  • FOUP load port
  • Pre-heat station

Vision system

  • RGB lighting
  • OCR recognition for substrates "Golden eye" upward looking camera


  • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142)
  • Pseudo X-Ray
  • Flip and P&P Tool Inspection
  • Needle Hole Inspection
  • Eject Tool Needle Inspection
  • Eject Tool Cap Inspection
  • Ejection System Live Cam
  • SECS GEM Parameter Provider
  • Wafermap Verification by Border Component
  • Configure User Level
  • Advanced Flux Imprint Check
  • Chipping Inspection
  • Auto Illumination
  • Distributed Bonding
  • Single Component Tracking
  • Lot Management
  • Complete bonding
  • Custom slow travel speed/distance
  • Measure component spacing
  • Measuring component bench
  • Fluxlevel detection
  • Individual bond position offsets
  • Advanced base calibration

Component presentation

  • Wafer stretcher (for 8" or 12" frames)
  • Various stretch adapters (for metal and plastic frames)
  • Wafer table rotation

Component handling system

  • Input TS ionizer
  • HEPA filter system class ISO5
  • Pneumatic terminal
  • Dipping station (slidefluxer)
  • Face-up
  • Tape & Reel
  • Temperature (constant)


  • External vacuum pump
  • Uninterruptable power supply
  • ALPS Host computer

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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