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Etch/Ash/Clean - Plasma Processing
Date of Manufacture: 2015-01-05
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
Model No. 2300e
FI SN: 1017439-15-25-1496
Model No. Flex FX Series
Ch1 SN: FLEX-331(F157417-PM1)
Ch2 SN: FLEX-332(F157417-PM2)
Ch3 SN: FLEX-333(F157417-PM3)
Ch4 SN: FLEX-334(F157417-PM4)
Ch5 SN: FLEX-335(F157417-PM5)
Process: Oxide
Software Version: 1.8.4 SP11-HF5
System Power Rating: 208 AC 3-Phase
Loading Configuration: 4 Load ports
Chm/Unit Position 1: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS, O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8
Chm/Unit Position 2: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS, O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8
Chm/Unit Position 3: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS, O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8
Chm/Unit Position 4: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS, O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8
Chm/Unit Position 5: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS, O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8
2300 System
Wafer Size: 300 mm wafers
Wafer Config: SEMI
Cassette Type: 25 Slot Cassette
Process Module Position and Quantity: 2300 Exelan Flex FX
Gas Box Type: JetStream
2300 Process Module
Maintenance Kits: Quick Clean Kit
Maintenance Kits: Quick Clean Kit w/ Electrode
Maintenance Kits: Liner Kit (Qty = QCK qty + QCK w/ Electrode qty)
Maintenance Kits: Pendulum Valve Clean Kit
Service Kits: Service Tool Kit
Service Kits: RF Maintenance Kit
Service Kits: VCI Test Probe
Service Kits: Two Stage Calibration Kit
Service Kits: Service Platform
Service Kits: Generator Cart
Chamber Type: 2300 Exelan Flex FX
2300 Exelan Flex FX Options
Chamber Enhancement: Adv. Temp Control
Electrode Gap: Adjustable Gap
Process Hardware Finish: Polished
Electrode Step: .16 Step
Upper Electrode Socket: Standard
Gas Feed: Adv. Top Plate 2-zone Gas Feed
Top Plate Enclosure: Vented Top Plate Enclosure
Top PI Chamber Manometer: Baffle
Advanced Confinement Control: ACC+
Gasket: Medium Power Gasket
Coupling Ring: Standard
Wafer Clamping Mechanism: EP-518
ESC Cooling: Dual Control, Dual Zone
Pin Lifter: Standard Temp
Wafer Lifter: Two Stage
Edge Rings: 35 Deg CER
Bias Match,2MHz Generator: 2Mhz High Power Pulsed
Bias Match,27MHz Generator: 27MHz Pulsed
Bias Match,60MHz Generator: 60Mhz Pulsed
300MM Turbo Pump: 2700 L/s BOCE
Endpoint Detection: Chamber Configurables, Optical Endpoint
Module Options: Bellow Removal Tool
PM Facilities : Dual Channel Chiller
PM Facilities Flow Rate: 10GPM
Coolant Hoses: High Pressure
TCU Leak Detection: Optical Coolant Leak Detector
Foreline Manometer: Heated
Foreline Heater: Non-Heated
Chamber Isolation Valve: Bonded Viton Barr. Seal Door 2
Vacuum Valve: Chemraz
Lower Isolation Valve: Viton Dry
Interconnect Hardware, Pump to TCU: Interconnect Cable Length
Interconnect Hardware, TCU to PM: Interconnect Cable Length
Interconnect Hardware, Pump to PM: Interconnect Cable Length
EMO Cable, TCU to RPDB: EMO Cable Length
EMO Cable, Pump to RPDB: EMO Cable Length
2300 Gas Box
Mounting Location: Transport Module
Door: Window
Primary Valve Options: Lock-out Tag-out Manual Valve
Facilitization: FIB
Facility Box Connection: Top Gas Connection
Facility Box Containment: Enhanced Containment
Facility Box Regulation: Tescom Regulator
Facility Box Filter: Nickel & SST(Gas Dependent)
Future PM: Position 1, 2, 3, 4, 5, 6
Inlet Pressure Measurement: Gauge Only
Gas System Exhaust: Top Exhaust
Gas System Option: IGS Tool Kit
Gas System Option: MFC Ergo Tool Kit
Gas System Option: Service Ladder
Gas System Option: Gas Box Hoist
Gas System Option: Upper Frame Lift Fixture
Gas System Option: AFVi
2300 Exelan Flex FX Gas Box Options
Process Gas Line Qty: Process Gas Line Qty _
Tuning Gas Options: 4
Heated Gas Lines: No Heated Gas Lines
Manifold Options: Multi-Exit (Pos 3 Exit)
AFVi Vacuum Weldments: Yes
Optional Gas Configuration: Custom Gas Lines
Gas Box Configuration
Gas Line 1: C4F6 200 sccm- STEC D219
Gas Line 2: COS 30 sccm - STEC D219
Gas Line 3: O2 20 sccm - STEC D219
Gas Line 4: CO 500 sccm - STEC D219
Gas Line 5: CH2F2 200sccm - STEC D219
Gas Line 6: C4F8 200 sccm - STEC D219
Gas Line 7: O2 200 sccm - STEC D219
Gas Line 8: CH3F 100sccm - STEC D219
Gas Line 9: CHF3 200 sccm - STEC D219
Gas Line 10: H2 300 sccm - STEC D219
Gas Line 11: NF3 30 sccm - STEC D219
Gas Line 12: N2 500 sccm - STEC D219
Gas Line 13: CF4 200 sccm - STEC D219
Tuning Gas 4/Line 14: AR 1000 sccm - STEC D219
Tuning Gas 3/Line 15: O2 3000 sccm - STEC D219
Tuning Gas 2/Line 16: O2 20 sccm - STEC D219
Tuning Gas 1/Line 17: C4F8 20 sccm- STEC D219
2300e Platform
ATM, EFEM: 3 Wide or 4 Wide EFEM Type
ATM Front Fascia: Standard Front Fascia
ATM Front End Load Port: 3 or 4 FOUP TDK
ATM Cassette ID: Selection for Carrier ID
ATM Wafer ID: WIDS Bottom Read
ATM, Light Curtain: Select if Light Curtain is needed
ATM Factory Automation: OHT PIO Sensor
ATM Wafer Aligner: Wafer Aligner
ATM End Effector Contact Pads: Kalrez
ATM Input Buffer Station: 25 Slot
ATM Auxiliary Buffer Station: 25 Slot Buffer Station Type
ATM,CTC Computer, Storage: Hard Disk Drive - Mirrored
ATM Controls User Interface: Tool Monitor and Keyboard configuration
ATM Controls UPS Circuitry: Selection for system UPS circuitry
ATM Controls ELB: Selection for Earth Leakage Breaker
VTM Throughput: Standard
VTM Loadlock A: Select appropriate configuration for platform type.
VTM Loadlock B: Select appropriate configuration for platform type.
VTM Conditioning Station A: No Conditioning Station
VTM Conditioning Station B: No Conditioning Station
VTM 25 Slot Buffer-Lwr Aux: Yes
VTM 25 Slot Buffer-Lwr Align: Yes
VTM 25 Slot Buffer-Lwr Alcove: Select if Buffer Station is needed in the Lower Alcove position
VTM 25 Slot Buffer-Upr Aux: No
VTM 25 Slot Buffer-Upr Align: No
VTM 25 Slot Buffer-Upr Alcove: No
VTM Clean Room Configuration: Defines tool will be configured for Ballroom or Bulkhead
VTM Airlock Wafer Fingers: Stainless Wafer Fingers
VTM Robot: Standard
VTM Backing Pumps: Kashiyama
VTM Robot End Effector: Kalrez
Subpanel (RPDB): RPDB
Subpanel Interconnect Cables: TM to Subpanel
Signal Tower: R-O-G-B Signal Tower
Software, System Control: Software Version 1.X
Platform System Options: System Calibration and Alignment
Platform System Options: Service Step for PM
Platform System Options: Robot CDM
Platform System Options: VTM Robot Lift
Platform System Options: Ionizer Kit
Platform System Options: TM Vacuum Hand Held Module
Platform System Options: APCS
Platform System Options: Facility Interface Board
Platform System Options: EFEM Yellow Light
Platform System Options: ATM Robot Removal Kit
Software
Platform: APC Recipe Tuning from Host
Platform: LamState
Platform: Wafer Flow Tuning
Platform: TEK Software
Distrubuted UI: Distrubuted UI
Additional Software: 2nd HSMS
LamRAMP: LamRAMP
LamRAMP: Individual LamRAMP Options
LamRAMP Options: Remote Station
LamRAMP Options: Configuration Browser
LamRAMP Options: Recipe Browser
LamRAMP Options: Alarm Browser
Number of Unit License: Number of License
Number of Site License: Number of License
LamFAST: LamFAST
LamFAST: Individual LamFAST Options
LamFAST Options: Lam DataAnalyzer
LamFAST Options: Lam SpectraAnalyzer
LamFAST Options: Lam WaferViewer
Number of Unit License: Number of License
Number of Site License: Number of License
Automated Procedure and Maint: AutoPM
Simulator Plus: Simulator Plus
Data Management: Equipment Information Mgmt Pkg
Data Management: EIM Server (Primary)
Data Management: EIM Server (Secondary)
Data Management: EIM Server UPS
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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