Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Date of Manufacture: 2007
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 7/8/2022
DRY ETCH 15-3LAM_EXELAN45_OX_03 LAM XLANABE OX
|Tool Model||Exelan Flex45|
|Software Version (include revision #)||1.8.4_SP5-HF1-Release|
|System Power Rating||200 AC 3-Phase|
|Loading Configuration||3 load ports|
|Vendor Chm Model||Chemicals / Gases Used (not to use Micron Proprietary names)|
|Chm/Unit Position 1||Flex45||C4F8,CF4,O2,Ar,CO,CH3F,C4F6,CH2F2,N2|
|Chm/Unit Position 2||Flex45||C4F8,CF4,O2,Ar,CO,CH3F,C4F6,CH2F2,N2|
|Chm/Unit Position 3||Flex45||C4F8,CF4,O2,Ar,CO,CH3F,C4F6,CH2F2,N2|
Fab15 confirmed there were no missing or damaged parts.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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