Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)
PVD (Physical Vapor Deposition)
Date of Manufacture: TBC
Currently Configured for: 300mm
Current Equipment Status: Incoming
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
Tool has been de-installed by a third party and is stored in an off-site warehouse.
PACKING LIST (SHIPMENT ITEMS LIST) AVAILABLE: PLEASE ASK YOUR SALES PERSON.
MISSING OR DAMAGED PARTS: CHECKING WITH FAB15 NOW.
[Chamber 2]
For Ti PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
HT ESC type stage
Ar;150/20sccm
[Chamber 3]
For TiN PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
A101 type stage
Ar/N2;150/200sccm
[Chamber 4]
For TiN PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
A101 type stage
Ar/N2;150/200sccm
[Chamber C]
For Pre-CLN chamber,PCXT
RFPS;CDX-2000,13.56/2MHz,COMDEL,for BIAS/SLA
PUMP/TMP MAG1300,LEYBOLD.
Ar;200/20sccm
[Chamber D]
For Pre-CLN chamber,PCXT
RFPS;CDX-2000,13.56/2MHz,COMDEL,for BIAS/SLA
PUMP/TMP MAG1300,LEYBOLD.
Ar;200/20sccm
[Chamber E]
For Degas,Plate heater
PUMP/CRYO,HELIX ON-BOARD IS
Ar,press. Controlled
[Chamber F]
For Degas,Plate heater
PUMP/CRYO,HELIX ON-BOARD IS
Ar,press. Controlled
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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