Macquarie Semiconductor and Technology on behalf of Micron Japan, Ltd.
Date of Manufacture: Feb 2006
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 5/27/2022
PROBE 15-3OMR_SL473G_LASER OMR SL473G LASER
TOWA (OMRON) LASERFRONT CORPORATION.
WAFER MARKER SL473G Specification
Laser Type : Nd:YAG laser (SHG) λ=532nm
Character Font : SEMI-OCR （Dot, Engraving） , OCR-B （Engraving）
Marking Target : Wafer surface observe-side (Option: Reverse-side, Both-side)
Throughput : 170pcs/h
Wafer Size : 12 inch
Power supply voltage : AC200V±20V, 20A , Single phase, 50/60Hz
Vacuum utility required : -77±10kPa, 0.01㎥/min
Compressed air utility required : 560±40kPa, 0.01㎥/min
Dimension [mm] : Approx. 1,640(W)×1,920(D)×1,550(H)
Main unit Weight : Approx. 1,000kg
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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