Macquarie Semiconductor and Technology on behalf of Macquarie (Asia) Pte Ltd. Taiwan Branch
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Etch/Ash/Clean - Plasma Processing
Date of Manufacture: 2003
Currently Configured for: 200mm
Current Equipment Status: Available
Location of Equipment: Taoyuan City, Taiwan
Available date: Currently Available
Inspect to confirm configuration and condition.
Process:Cu Metal trench/via etch
1. SiO2 ETCH
2. Si3N4 ETCH
The system can produce wafers as-is.
OEM and 3rd Party audit are available.
Handler Type is LPT 2200
Robot Type is ROBOT..DBR930899-A ROBOT M5 (SCCM ROBOT)
End-Effecter Type is XFR SYS BR940209 8" FORK U-2
Pre-Aligner is include.
System SW (OS) version is UNITY-ECC ver 2.35-Rev403-GEM-5.56c
Power Supply / AC Dist Box / UPS are include.
Facility Requirements: CDA / DIW / Vacuum / Gas / Power
The Fork / SMIF / Chiller / pump of this equipment has been lost.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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